316 results (0.002 seconds)

CVSS: 7.8EPSS: 0%CPEs: 518EXPL: 0

Memory corruption in Audio while processing the VOC packet data from ADSP. Corrupción de la memoria en Audio mientras se procesan los datos del paquete VOC desde ADSP. • https://www.qualcomm.com/company/product-security/bulletins/november-2023-bulletin • CWE-191: Integer Underflow (Wrap or Wraparound) CWE-787: Out-of-bounds Write •

CVSS: 7.8EPSS: 0%CPEs: 590EXPL: 0

Memory corruption in WLAN HAL while handling command streams through WMI interfaces. Corrupción de memoria en WLAN HAL al manejar flujos de comandos a través de interfaces WMI. • https://www.qualcomm.com/company/product-security/bulletins/september-2023-bulletin • CWE-129: Improper Validation of Array Index CWE-787: Out-of-bounds Write •

CVSS: 7.8EPSS: 0%CPEs: 534EXPL: 0

Memory corruption in WLAN HAL while processing devIndex from untrusted WMI payload. Corrupción de memoria en WLAN HAL al procesar devIndex desde un payload WMI no fiable. • https://www.qualcomm.com/company/product-security/bulletins/september-2023-bulletin • CWE-120: Buffer Copy without Checking Size of Input ('Classic Buffer Overflow') CWE-787: Out-of-bounds Write •

CVSS: 8.4EPSS: 0%CPEs: 566EXPL: 0

Memory corruption in WLAN HAL while processing WMI-UTF command or FTM TLV1 command. • https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin • CWE-119: Improper Restriction of Operations within the Bounds of a Memory Buffer CWE-787: Out-of-bounds Write •

CVSS: 5.5EPSS: 0%CPEs: 86EXPL: 0

While deserializing any key blob during key operations, buffer overflow could occur exposing partial key information if any key operations are invoked(Depends on CVE-2018-13907) in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in MDM9150, MDM9205, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130 Mientras se deserializa cualquier blob de teclas durante las operaciones de clave, puede presentarse un desbordamiento de búfer que expone información de clave parcial si cualquier operación clave es invocada (depende de el CVE-2018-13907) en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking en las versiones MDM9150, MDM9205, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130. • https://www.qualcomm.com/company/product-security/bulletins • CWE-119: Improper Restriction of Operations within the Bounds of a Memory Buffer •