CVSS: 9.8EPSS: 0%CPEs: 300EXPL: 0CVE-2022-22088 – Integer Overflow to Buffer Overflow in Bluetooth HOST
https://notcve.org/view.php?id=CVE-2022-22088
Memory corruption in Bluetooth HOST due to buffer overflow while parsing the command response received from remote • https://www.qualcomm.com/company/product-security/bulletins/january-2023-bulletin • CWE-787: Out-of-bounds Write •
CVSS: 4.6EPSS: 0%CPEs: 92EXPL: 0CVE-2022-22079 – Buffer Over-read in BOOT
https://notcve.org/view.php?id=CVE-2022-22079
Denial of service while processing fastboot flash command on mmc due to buffer over read Denegación de servicio al procesar el comando flash fastboot en mmc debido a sobrelectura del búfer • https://www.qualcomm.com/company/product-security/bulletins/january-2023-bulletin • CWE-125: Out-of-bounds Read •
CVSS: 8.4EPSS: 0%CPEs: 32EXPL: 0CVE-2022-25698
https://notcve.org/view.php?id=CVE-2022-25698
Memory corruption in SPI buses due to improper input validation while reading address configuration from spi buses in Snapdragon Mobile, Snapdragon Wearables Corrupción de la memoria en los buses SPI debido a una validación de entrada incorrecta al leer la configuración de direcciones de los buses spi en Snapdragon Mobile, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/december-2022-bulletin • CWE-787: Out-of-bounds Write •
CVSS: 7.5EPSS: 0%CPEs: 124EXPL: 0CVE-2022-25692
https://notcve.org/view.php?id=CVE-2022-25692
Denial of service in Modem due to reachable assertion while processing the common config procedure in Snapdragon Auto, Snapdragon Compute, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables Denegación de servicio en el módem debido a una afirmación accesible mientras se procesa el procedimiento de configuración común en Snapdragon Auto, Snapdragon Compute, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/december-2022-bulletin • CWE-617: Reachable Assertion •
CVSS: 7.8EPSS: 0%CPEs: 286EXPL: 0CVE-2022-25677
https://notcve.org/view.php?id=CVE-2022-25677
Memory corruption in diag due to use after free while processing dci packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Corrupción de la memoria en diagnóstico debido al use-after-free mientras se procesa el paquete dci en Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking • https://www.qualcomm.com/company/product-security/bulletins/december-2022-bulletin • CWE-416: Use After Free •