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CVSS: 7.8EPSS: 0%CPEs: 72EXPL: 0

CVE-2019-10496

https://notcve.org/view.php?id=CVE-2019-10496

Lack of checking a variable received from driver and populating in Firmware data structure leads to buffer overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130 Una falta de comprobación de una variable recibida desde el controlador y el llenado en la estructura de datos del firmware conlleva al desbordamiento del búfer en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en las versiones MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130. • https://source.android.com/security/bulletin • CWE-120: Buffer Copy without Checking Size of Input ('Classic Buffer Overflow') •

CVSS: 10.0EPSS: 0%CPEs: 72EXPL: 0

CVE-2019-2252

https://notcve.org/view.php?id=CVE-2019-2252

Classic buffer overflow vulnerability while playing the specific video whose Decode picture buffer size is more than 16 in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9650, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130 Una vulnerabilidad de desbordamiento del búfer clásica mientras se reproduce el video específico cuyo tamaño de búfer de imagen Decode es más de 16 en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en las versiones MDM9650, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130. • https://www.qualcomm.com/company/product-security/bulletins • CWE-120: Buffer Copy without Checking Size of Input ('Classic Buffer Overflow') •

CVSS: 10.0EPSS: 0%CPEs: 94EXPL: 0

CVE-2019-2294

https://notcve.org/view.php?id=CVE-2019-2294

Usage of hard-coded magic number for calculating heap guard bytes can allow users to corrupt heap blocks without heap algorithm knowledge in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9205, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9655, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130 El uso de un número mágico embebido para calcular los bytes de protección de la pila puede permitir a los usuarios corromper los bloques de la pila sin el conocimiento del algoritmo de la misma en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en las versiones MDM9205, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9655, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130 • https://www.qualcomm.com/company/product-security/bulletins • CWE-330: Use of Insufficiently Random Values •

CVSS: 5.5EPSS: 0%CPEs: 72EXPL: 0

CVE-2019-2343

https://notcve.org/view.php?id=CVE-2019-2343

Out of bound read and information disclosure in firmware due to insufficient checking of an embedded structure that can be sent from a kernel driver in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130 Lectura fuera del límite y divulgación de información en el firmware debido a una comprobación insuficiente de una estructura incrustada que se puede enviar desde un controlador del kernel en Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130. • https://www.qualcomm.com/company/product-security/bulletins • CWE-125: Out-of-bounds Read •

CVSS: 10.0EPSS: 0%CPEs: 88EXPL: 0

CVE-2019-2327

https://notcve.org/view.php?id=CVE-2019-2327

Possible buffer overflow can occur when playing clip with incorrect element size in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 600, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, Snapdragon_High_Med_2016 Un posible desbordamiento del búfer puede ocurrir cuando se reproduce un clip con un tamaño de elemento incorrecto en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT,Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en las versiones MDM9150, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 600, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, Snapdragon_High_Med_2016 • https://www.qualcomm.com/company/product-security/bulletins • CWE-119: Improper Restriction of Operations within the Bounds of a Memory Buffer •