CVE-2024-23368 – Buffer Copy Without Checking Size of Input (`Classic Buffer Overflow`) in Qualcomm IPC
https://notcve.org/view.php?id=CVE-2024-23368
Memory corruption when allocating and accessing an entry in an SMEM partition. Corrupción de la memoria al asignar y acceder a una entrada en una partición SMEM. • https://docs.qualcomm.com/product/publicresources/securitybulletin/july-2024-bulletin.html • CWE-120: Buffer Copy without Checking Size of Input ('Classic Buffer Overflow') •
CVE-2023-33116 – Buffer over-read without Checking Size of Input in WLAN Host
https://notcve.org/view.php?id=CVE-2023-33116
Transient DOS while parsing ieee80211_parse_mscs_ie in WIN WLAN driver. DOS transitorio mientras se analiza ieee80211_parse_mscs_ie en el controlador WIN WLAN. • https://www.qualcomm.com/company/product-security/bulletins/january-2024-bulletin • CWE-125: Out-of-bounds Read CWE-126: Buffer Over-read •
CVE-2023-33083 – Buffer Copy Without Checking Size of Input (`Classic Buffer Overflow`) in WLAN Host
https://notcve.org/view.php?id=CVE-2023-33083
Memory corruption in WLAN Host while processing RRM beacon on the AP. Corrupción de la memoria en el host WLAN mientras se procesa beacon RRM en el AP. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-120: Buffer Copy without Checking Size of Input ('Classic Buffer Overflow') •
CVE-2023-33082 – Buffer Copy Without Checking Size of Input (`Classic Buffer Overflow`) in WLAN Host
https://notcve.org/view.php?id=CVE-2023-33082
Memory corruption while sending an Assoc Request having BTM Query or BTM Response containing MBO IE. Corrupción de la memoria al enviar una solicitud de asociación con una consulta BTM o una respuesta BTM que contiene MBO IE. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-120: Buffer Copy without Checking Size of Input ('Classic Buffer Overflow') •
CVE-2023-33063 – Qualcomm Multiple Chipsets Use-After-Free Vulnerability
https://notcve.org/view.php?id=CVE-2023-33063
Memory corruption in DSP Services during a remote call from HLOS to DSP. Corrupción de la memoria en los servicios DSP durante una llamada remota de HLOS a DSP. Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-416: Use After Free •