// For flags

CVE-2020-10255

 

Severity Score

9.0
*CVSS v3.1

Exploit Likelihood

*EPSS

Affected Versions

*CPE

Public Exploits

0
*Multiple Sources

Exploited in Wild

-
*KEV

Decision

-
*SSVC
Descriptions

Modern DRAM chips (DDR4 and LPDDR4 after 2015) are affected by a vulnerability in deployment of internal mitigations against RowHammer attacks known as Target Row Refresh (TRR), aka the TRRespass issue. To exploit this vulnerability, the attacker needs to create certain access patterns to trigger bit flips on affected memory modules, aka a Many-sided RowHammer attack. This means that, even when chips advertised as RowHammer-free are used, attackers may still be able to conduct privilege-escalation attacks against the kernel, conduct privilege-escalation attacks against the Sudo binary, and achieve cross-tenant virtual-machine access by corrupting RSA keys. The issue affects chips produced by SK Hynix, Micron, and Samsung. NOTE: tracking DRAM supply-chain issues is not straightforward because a single product model from a single vendor may use DRAM chips from different manufacturers.

Los chips DRAM modernos (DDR4 y LPDDR4 después de 2015) están afectados por una vulnerabilidad en la implementación de mitigaciones internas contra los ataques de tipo RowHammer conocido como Target Row Refresh (TRR), también se conoce como el problema TRRespass. Para explotar esta vulnerabilidad, el atacante requiere crear determinados patrones de acceso para activar cambios de bits sobre los módulos de memoria afectados, también se conoce como un ataque de tipo RowHammer de Muchos Flancos. Esto significa que, incluso cuando son usados chips anunciados como RowHammer-free, los atacantes aún pueden ser capaces de dirigir ataques de escalada de privilegios contra el kernel, conducir ataques de escalada de privilegios contra el binario Sudo y lograr el acceso a máquinas virtuales entre inquilinos al corromper claves RSA. El problema afecta a los chips producidos por SK Hynix, Micron y Samsung. NOTA: el seguimiento de los problemas de la cadena de suministro de DRAM no es sencillo porque un solo modelo de producto de un único proveedor puede usar chips DRAM de diferentes fabricantes.

*Credits: N/A
CVSS Scores
Attack Vector
Network
Attack Complexity
High
Privileges Required
None
User Interaction
None
Scope
Changed
Confidentiality
High
Integrity
High
Availability
High
Attack Vector
Network
Attack Complexity
Medium
Authentication
None
Confidentiality
Complete
Integrity
Complete
Availability
Complete
* Common Vulnerability Scoring System
SSVC
  • Decision:-
Exploitation
-
Automatable
-
Tech. Impact
-
* Organization's Worst-case Scenario
Timeline
  • 2020-03-09 CVE Reserved
  • 2020-03-10 CVE Published
  • 2024-08-04 CVE Updated
  • 2024-10-04 EPSS Updated
  • ---------- Exploited in Wild
  • ---------- KEV Due Date
  • ---------- First Exploit
CWE
  • CWE-20: Improper Input Validation
CAPEC
Affected Vendors, Products, and Versions
Vendor Product Version Other Status
Vendor Product Version Other Status <-- --> Vendor Product Version Other Status
Micron
Search vendor "Micron"
Ddr4 Sdram
Search vendor "Micron" for product "Ddr4 Sdram"
--
Affected
Micron
Search vendor "Micron"
Lpddr4
Search vendor "Micron" for product "Lpddr4"
--
Affected
Samsung
Search vendor "Samsung"
Ddr4
Search vendor "Samsung" for product "Ddr4"
--
Affected
Samsung
Search vendor "Samsung"
Lpddr4
Search vendor "Samsung" for product "Lpddr4"
--
Affected
Skhynix
Search vendor "Skhynix"
Ddr4 Sdram
Search vendor "Skhynix" for product "Ddr4 Sdram"
--
Affected
Skhynix
Search vendor "Skhynix"
Lpddr4
Search vendor "Skhynix" for product "Lpddr4"
--
Affected