CVE-2023-33063 – Qualcomm Multiple Chipsets Use-After-Free Vulnerability
https://notcve.org/view.php?id=CVE-2023-33063
Memory corruption in DSP Services during a remote call from HLOS to DSP. Corrupción de la memoria en los servicios DSP durante una llamada remota de HLOS a DSP. Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-416: Use After Free •
CVE-2023-33059 – Buffer Copy Without Checking Size of Input in Audio
https://notcve.org/view.php?id=CVE-2023-33059
Memory corruption in Audio while processing the VOC packet data from ADSP. Corrupción de la memoria en Audio mientras se procesan los datos del paquete VOC desde ADSP. • https://www.qualcomm.com/company/product-security/bulletins/november-2023-bulletin • CWE-191: Integer Underflow (Wrap or Wraparound) CWE-787: Out-of-bounds Write •
CVE-2022-40521 – Improper authorization in Modem
https://notcve.org/view.php?id=CVE-2022-40521
Transient DOS due to improper authorization in Modem • https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin • CWE-285: Improper Authorization CWE-287: Improper Authentication •
CVE-2022-33264 – Stack-based buffer overflow in Modem
https://notcve.org/view.php?id=CVE-2022-33264
Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message. • https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin • CWE-121: Stack-based Buffer Overflow CWE-787: Out-of-bounds Write •
CVE-2022-22076 – Cryptographic issue in Core
https://notcve.org/view.php?id=CVE-2022-22076
information disclosure due to cryptographic issue in Core during RPMB read request. • https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin • CWE-310: Cryptographic Issues •