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CVSS: 7.8EPSS: 0%CPEs: 78EXPL: 0

CVE-2017-18279

https://notcve.org/view.php?id=CVE-2017-18279

Lack of check of buffer length before copying can lead to buffer overflow in camera module in Small Cell SoC, Snapdragon Mobile, Snapdragon Wear in FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, QCA9558, QCA9563, QCA9880, QCA9886, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016. La falta de comprobación de la longitud del búfer antes de copiar puede provocar un desbordamiento del búfer en el módulo de la cámara en Small Cell SoC, Snapdragon Mobile, Snapdragon Wear en FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, QCA9558, QCA9563, QCA9880, QCA9886, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016. • https://www.qualcomm.com/company/product-security/bulletins • CWE-190: Integer Overflow or Wraparound •

CVSS: 5.5EPSS: 0%CPEs: 42EXPL: 0

CVE-2017-18275

https://notcve.org/view.php?id=CVE-2017-18275

A new account can be inserted into simContacts service using Android command line tool in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845. Se puede insertar una nueva cuenta en el servicio simContacts utilizando la herramienta de línea de comandos Android en Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear en MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845. • https://www.qualcomm.com/company/product-security/bulletins •

CVSS: 7.8EPSS: 0%CPEs: 42EXPL: 0

CVE-2017-18157

https://notcve.org/view.php?id=CVE-2017-18157

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20. Una condición de uso después de liberar la memoria puede ocurrir en Thermal Engine en Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear en MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20. • https://www.qualcomm.com/company/product-security/bulletins • CWE-416: Use After Free •

CVSS: 5.5EPSS: 0%CPEs: 32EXPL: 0

CVE-2017-15841

https://notcve.org/view.php?id=CVE-2017-15841

When HOST sends a Special command ID packet, Controller triggers a RAM Dump and FW reset in Snapdragon Mobile in version SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, Snapdragon_High_Med_2016. Cuando HOST envía un paquete de ID de comando especial, el controlador activa un volcado de RAM y un restablecimiento de FW en Snapdragon Mobile en las versiones SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, Snapdragon_High_Med_2016. • https://www.qualcomm.com/company/product-security/bulletins •

CVSS: 7.8EPSS: 0%CPEs: 56EXPL: 0

CVE-2017-18131

https://notcve.org/view.php?id=CVE-2017-18131

In QTEE, an incorrect fuse value can be blown in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 820, SD 820A, SD 835, SD 845, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016. En QTEE, se puede sobrecargar un valor de fusible incorrecto en Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear en las versiones MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 820, SD 820A, SD 835, SD 845, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016. • https://www.qualcomm.com/company/product-security/bulletins • CWE-665: Improper Initialization •