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CVSS: 7.8EPSS: 0%CPEs: 68EXPL: 0

CVE-2017-18141

https://notcve.org/view.php?id=CVE-2017-18141

When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. En las versiones IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24 y Snapdragon_High_Med_2016 de Snapdragon Automobile, Snapdragon Mobile y Snapdragon Wear, el hecho de cargar un TEE de terceros para el mundo no seguro con el fin de crear una llamada de monitorización segura, la cual concederá a dicho TEE el acceso a funciones privilegiadas, significaba ser solamente accesible desde el TEE. • http://www.securityfocus.com/bid/106128 https://www.qualcomm.com/company/product-security/bulletins •

CVSS: 5.5EPSS: 0%CPEs: 70EXPL: 0

CVE-2017-18323

https://notcve.org/view.php?id=CVE-2017-18323

Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130. Material de clave criptográfica filtrado en los mensajes de depuración de TDSCDMA RRC en snapdragon automobile, snapdragon mobile y snapdragon wear en sus versiones MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20 y SXR1130. • http://www.securityfocus.com/bid/106128 https://www.qualcomm.com/company/product-security/bulletins • CWE-320: Key Management Errors •

CVSS: 7.8EPSS: 0%CPEs: 48EXPL: 0

CVE-2017-18328

https://notcve.org/view.php?id=CVE-2017-18328

Use after free in QSH client rule processing in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 820, SD 835, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016. Vulnerabilidad de uso de memoria previamente liberada en el procesamiento de reglas del cliente en QSH en snapdragon mobile y snapdragon wear en sus versiones MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 820, SD 835, SDA660, SDM630, SDM660 y Snapdragon_High_Med_2016. • http://www.securityfocus.com/bid/106128 https://www.qualcomm.com/company/product-security/bulletins • CWE-416: Use After Free •

CVSS: 5.5EPSS: 0%CPEs: 74EXPL: 0

CVE-2017-11004

https://notcve.org/view.php?id=CVE-2017-11004

A non-secure user may be able to access certain registers in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. Un usuario inseguro podría acceder a determinados registros en snapdragon automobile, snapdragon mobile y en snapdragon wear en sus versiones IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24 y Snapdragon_High_Med_2016. • http://www.securityfocus.com/bid/106128 https://www.qualcomm.com/company/product-security/bulletins •

CVSS: 7.8EPSS: 0%CPEs: 78EXPL: 0

CVE-2017-18330

https://notcve.org/view.php?id=CVE-2017-18330

Buffer overflow in AES-CCM and AES-GCM encryption via initialization vector in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. Desbordamiento de búfer en el cifrado de AES-CCM y AES-GCM mediante el vector de inicialización en snapdragon automobile, snapdragon mobile y snapdragon wear en sus versiones IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24 y Snapdragon_High_Med_2016. • http://www.securityfocus.com/bid/106128 https://www.qualcomm.com/company/product-security/bulletins •