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CVE-2020-11235
https://notcve.org/view.php?id=CVE-2020-11235
09 Jun 2021 — Buffer overflow might occur while parsing unified command due to lack of check of input data received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking Un desbordamiento del búfer puede ocurrir cuando se analiza un comando unificado debido a una falta de comprobación de los datos de entrada... • https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin • CWE-190: Integer Overflow or Wraparound •
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CVE-2020-11233
https://notcve.org/view.php?id=CVE-2020-11233
09 Jun 2021 — Time-of-check time-of-use race condition While processing partition entries due to newly created buffer was read again from mmc without validation in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Una condición de carrera de Time-of-check time-of-use mientras se procesaban las entradas de la partición debido al búfer recién diseñado, se volvió a leer desde mmc sin comprobación en los productos Sn... • https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin • CWE-367: Time-of-check Time-of-use (TOCTOU) Race Condition •
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CVE-2020-11161
https://notcve.org/view.php?id=CVE-2020-11161
09 Jun 2021 — Out-of-bounds memory access can occur while calculating alignment requirements for a negative width from external components in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music Un acceso a la memoria fuera de límites puede ocurrir mientras se calculan los requisitos de alineación para un ancho negativo de componentes externos en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivi... • https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin • CWE-125: Out-of-bounds Read •
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CVE-2020-11159
https://notcve.org/view.php?id=CVE-2020-11159
09 Jun 2021 — Buffer over-read can happen while processing WPA,RSN IE of beacon and response frames if IE length is less than length of frame pointer being accessed in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking Una sobrelectura del búfer puede ocurrir mientras se procesa WPA, RSN IE de la baliza y la... • https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin • CWE-125: Out-of-bounds Read •
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CVE-2021-1910
https://notcve.org/view.php?id=CVE-2021-1910
07 May 2021 — Double free in video due to lack of input buffer length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Una doble liberación en video debido a una falta de comprobación de la longitud del búfer de la entrada en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Vo... • https://www.qualcomm.com/company/product-security/bulletins/may-2021-bulletin • CWE-415: Double Free •
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CVE-2021-1905 – Qualcomm Multiple Chipsets Use-After-Free Vulnerability
https://notcve.org/view.php?id=CVE-2021-1905
07 May 2021 — Possible use after free due to improper handling of memory mapping of multiple processes simultaneously. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Un posible uso de la memoria previamente liberada debido a un manejo inapropiado de la asignación de la memoria de múltiples procesos simultáneamente. en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Con... • https://www.qualcomm.com/company/product-security/bulletins/may-2021-bulletin • CWE-416: Use After Free •
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CVE-2021-1906 – Qualcomm Multiple Chipsets Detection of Error Condition Without Action Vulnerability
https://notcve.org/view.php?id=CVE-2021-1906
07 May 2021 — Improper handling of address deregistration on failure can lead to new GPU address allocation failure. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Un manejo inapropiado de la cancelación del registro de direcciones en caso de fallo puede conllevar a un fallo en la asignación de direcciones de la nueva GPU. En los productos Snapdragon Auto, Snapdragon Compute, Snapdr... • https://www.qualcomm.com/company/product-security/bulletins/may-2021-bulletin • CWE-755: Improper Handling of Exceptional Conditions •
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CVE-2020-11285
https://notcve.org/view.php?id=CVE-2020-11285
07 May 2021 — Buffer over-read while unpacking the RTCP packet we may read extra byte if wrong length is provided in RTCP packets in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Una lectura excesiva del búfer mientras desempaquetamos el paquete RTCP, podemos leer un byte adicional si es proporcionada una longitud inapropiada en los paquetes RTCP en los productos Snapdragon... • https://www.qualcomm.com/company/product-security/bulletins/may-2021-bulletin • CWE-125: Out-of-bounds Read •
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CVE-2020-11279
https://notcve.org/view.php?id=CVE-2020-11279
07 May 2021 — Memory corruption while processing crafted SDES packets due to improper length check in sdes packets recieved in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Una corrupción de la memoria durante el procesamiento de paquetes SDES diseñados debido a una comprobación inapropiada de longitud en los paquetes sdes recibidos en los productos Snapdragon Auto, Snapdra... • https://www.qualcomm.com/company/product-security/bulletins/may-2021-bulletin • CWE-190: Integer Overflow or Wraparound •
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CVE-2020-11255
https://notcve.org/view.php?id=CVE-2020-11255
07 Apr 2021 — Denial of service while processing RTCP packets containing multiple SDES reports due to memory for last SDES packet is freed and rest of the memory is leaked in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables Una denegación de servicio mientras se procesan paquetes RTCP que contienen múltiples reportes SDES debido a que la memoria del último paquete SDES es liberada y el resto de la memo... • https://www.qualcomm.com/company/product-security/bulletins/april-2021-bulletin • CWE-401: Missing Release of Memory after Effective Lifetime •