CVSS: 7.5EPSS: 0%CPEs: 298EXPL: 0CVE-2023-33081 – Buffer over-read in WLAN Firmware
https://notcve.org/view.php?id=CVE-2023-33081
Transient DOS while converting TWT (Target Wake Time) frame parameters in the OTA broadcast. DOS transitorio al convertir parámetros de fotograma TWT (Target Wake Time) en la transmisión OTA. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-125: Out-of-bounds Read CWE-126: Buffer Over-read •
CVSS: 7.5EPSS: 0%CPEs: 732EXPL: 0CVE-2023-33080 – Buffer over-read in WLAN Firmware
https://notcve.org/view.php?id=CVE-2023-33080
Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. DOS transitorio mientras se analiza un IE (elemento de información) específico del fabricante del frame de gestión de respuesta de reasociación. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-125: Out-of-bounds Read CWE-126: Buffer Over-read •
CVSS: 7.8EPSS: 0%CPEs: 288EXPL: 0CVE-2023-33079 – Use of Out-of-range Pointer Offset in Audio
https://notcve.org/view.php?id=CVE-2023-33079
Memory corruption in Audio while running invalid audio recording from ADSP. Corrupción de la memoria en audio mientras se ejecuta una grabación de audio no válida desde ADSP. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-119: Improper Restriction of Operations within the Bounds of a Memory Buffer CWE-823: Use of Out-of-range Pointer Offset •
CVSS: 7.1EPSS: 0%CPEs: 204EXPL: 0CVE-2023-33070 – Improper Authentication in Automotive OS
https://notcve.org/view.php?id=CVE-2023-33070
Transient DOS in Automotive OS due to improper authentication to the secure IO calls. DOS transitorio en sistemas operativos automotrices debido a una autenticación incorrecta en las llamadas IO seguras. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-287: Improper Authentication •
CVSS: 7.8EPSS: 0%CPEs: 562EXPL: 0CVE-2023-33063 – Qualcomm Multiple Chipsets Use-After-Free Vulnerability
https://notcve.org/view.php?id=CVE-2023-33063
Memory corruption in DSP Services during a remote call from HLOS to DSP. Corrupción de la memoria en los servicios DSP durante una llamada remota de HLOS a DSP. Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-416: Use After Free •