CVSS: 7.8EPSS: 0%CPEs: 84EXPL: 0CVE-2018-11928
https://notcve.org/view.php?id=CVE-2018-11928
24 May 2019 — Lack of check on length parameter may cause buffer overflow while processing WMI commands in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in IPQ8074, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6174A, QCA6564, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA8081, QCA9377, QCA9379, QCA9886, QCS605, SD 21... • https://www.qualcomm.com/company/product-security/bulletins#_CVE-2018-11928 • CWE-119: Improper Restriction of Operations within the Bounds of a Memory Buffer •
CVSS: 7.8EPSS: 0%CPEs: 52EXPL: 0CVE-2018-11927
https://notcve.org/view.php?id=CVE-2018-11927
24 May 2019 — Improper input validation on input which is used as an array index will lead to an out of bounds issue while processing AP find event from firmware in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6174A, QCA6574AU, QCA9377, QCA9379, SD 210/SD 212/SD 205, SD 625, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 845 / SD 850, SD 855... • https://www.codeaurora.org/security-bulletin/2019/04/01/april-2019-code-aurora-security-bulletin • CWE-129: Improper Validation of Array Index •
CVSS: 9.8EPSS: 0%CPEs: 84EXPL: 0CVE-2018-11271
https://notcve.org/view.php?id=CVE-2018-11271
24 May 2019 — Improper authentication can happen on Remote command handling due to inappropriate handling of events in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670... • https://www.qualcomm.com/company/product-security/bulletins#_CVE-2018-11271 • CWE-287: Improper Authentication •
CVSS: 7.8EPSS: 0%CPEs: 78EXPL: 0CVE-2017-18279
https://notcve.org/view.php?id=CVE-2017-18279
06 May 2019 — Lack of check of buffer length before copying can lead to buffer overflow in camera module in Small Cell SoC, Snapdragon Mobile, Snapdragon Wear in FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, QCA9558, QCA9563, QCA9880, QCA9886, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016. La falta de comprobación de l... • https://www.qualcomm.com/company/product-security/bulletins • CWE-190: Integer Overflow or Wraparound •
CVSS: 7.8EPSS: 0%CPEs: 34EXPL: 0CVE-2017-18278
https://notcve.org/view.php?id=CVE-2017-18278
06 May 2019 — An integer underflow may occur due to lack of check when received data length from font_mgr_qsee_request_service is bigger than the minimal value of the segment header, which may result in a buffer overflow, in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850. Puede producirse un subdesbordamiento de enteros debido a la falta de comprobación cuando la longitud de lo... • https://www.qualcomm.com/company/product-security/bulletins • CWE-191: Integer Underflow (Wrap or Wraparound) •
CVSS: 5.5EPSS: 0%CPEs: 42EXPL: 0CVE-2017-18275
https://notcve.org/view.php?id=CVE-2017-18275
06 May 2019 — A new account can be inserted into simContacts service using Android command line tool in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845. Se puede insertar una nueva cuenta en el servicio simContacts utilizando la herramienta de línea de comandos Android en Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear en MDM9206, MDM9607, M... • https://www.qualcomm.com/company/product-security/bulletins •
CVSS: 7.8EPSS: 0%CPEs: 32EXPL: 0CVE-2017-18274
https://notcve.org/view.php?id=CVE-2017-18274
06 May 2019 — While iterating through the models contained in a fixed-size array in the actData structure, which also stores an incorrect number of models that is greater than the size of the array, a buffer overflow occurs in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835 Al iterar a través de los modelos contenidos en un array de tamaño fijo en la estructura actData, que también alma... • https://www.qualcomm.com/company/product-security/bulletins • CWE-129: Improper Validation of Array Index •
CVSS: 7.8EPSS: 0%CPEs: 26EXPL: 0CVE-2017-18173
https://notcve.org/view.php?id=CVE-2017-18173
06 May 2019 — In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016. En caso de utilizar una firma de arranque verificada por Android no válida con una longitud muy grande, se produce un subdesbordamiento de enteros en Snapdragon Mobile en SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM... • https://www.qualcomm.com/company/product-security/bulletins • CWE-190: Integer Overflow or Wraparound •
CVSS: 7.8EPSS: 0%CPEs: 42EXPL: 0CVE-2017-18157
https://notcve.org/view.php?id=CVE-2017-18157
06 May 2019 — A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20. Una condición de uso después de liberar la memoria puede ocurrir en Thermal Engine en Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear en MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 45... • https://www.qualcomm.com/company/product-security/bulletins • CWE-416: Use After Free •
CVSS: 7.8EPSS: 0%CPEs: 24EXPL: 0CVE-2017-18156
https://notcve.org/view.php?id=CVE-2017-18156
06 May 2019 — While processing camera buffers in camera driver, a use after free condition can occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20. Durante el procesamiento de los búferes de la cámara en el controlador de la cámara, se puede producir una condición de referencia a memoria después de que haya sido liberada en Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear en MDM9206, MDM9607, MDM9... • https://www.qualcomm.com/company/product-security/bulletins • CWE-416: Use After Free •