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CVSS: 5.5EPSS: 0%CPEs: 62EXPL: 0

CVE-2019-2241

https://notcve.org/view.php?id=CVE-2019-2241

While rendering the layout background, Error status check is not caught properly and also incorrect status handling is being done leading to unintended SUI behaviour in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9150, MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCS404, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 636, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM630, SDM660, SDX24, SXR1130 Mientras se renderiza el fondo del diseño, la comprobación del estado Error no se detecta apropiadamente y también se está realizando un manejo incorrecto del estado, lo que conduce a un comportamiento no previsto de la SUI en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking en las versiones MDM9150, MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCS404, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 636, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM630, SDM660, SDX24, SXR1130 • https://www.qualcomm.com/company/product-security/bulletins • CWE-755: Improper Handling of Exceptional Conditions •

CVSS: 5.5EPSS: 0%CPEs: 100EXPL: 0

CVE-2019-2239

https://notcve.org/view.php?id=CVE-2019-2239

Sanity checks are missing in layout which can lead to SUI Corruption or can lead to Denial of Service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in MDM9150, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24, Snapdragon_High_Med_2016, SXR1130 En el diseño faltan las comprobaciones de control que pueden llevar a la corrupción de SUI o la Denegación de Servicio en Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking en MDM9150, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24, Snapdragon_High_Med_2016, SXR1130. • https://www.qualcomm.com/company/product-security/bulletins • CWE-129: Improper Validation of Array Index •

CVSS: 7.8EPSS: 0%CPEs: 70EXPL: 0

CVE-2019-2235

https://notcve.org/view.php?id=CVE-2019-2235

Buffer overflow occurs when emulated RPMB is used due to sector size assumptions in the TA rollback protection logic. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130 Un desbordamiento de búfer ocurre cuando es utilizado RPMB emulado debido a suposiciones de tamaño de sector en la lógica de protección rollback de TA. En los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking en las versiones MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130. • https://www.qualcomm.com/company/product-security/bulletins • CWE-119: Improper Restriction of Operations within the Bounds of a Memory Buffer •

CVSS: 7.8EPSS: 0%CPEs: 48EXPL: 0

CVE-2018-13927

https://notcve.org/view.php?id=CVE-2018-13927

Debug policy with invalid signature can be loaded when the debug policy functionality is disabled by using the parallel image loading in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCS404, QCS605, SD 410/12, SD 636, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM630, SDM660, SXR1130 La política de depuración con firma no válida puede ser cargada cuando la funcionalidad debug policy está deshabilitada mediante el uso de la carga de imagen paralela en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking en las versiones MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCS404, QCS605, SD 410/12, SD 636, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM630, SDM660, SXR1130 • https://www.qualcomm.com/company/product-security/bulletins • CWE-287: Improper Authentication •

CVSS: 7.8EPSS: 0%CPEs: 72EXPL: 0

CVE-2018-13896

https://notcve.org/view.php?id=CVE-2018-13896

XBL_SEC image authentication and other crypto related validations are accessible to a compromised OEM XBL Loader due to missing lock at XBL_SEC stage.. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130 La autenticación de imagen XBL_SEC puede ser accedida y otras comprobaciones relacionadas con criptografía en un Cargador OEM XBL comprometido debido a la falta de bloqueo en la etapa XBL_SEC.. en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking en las versiones MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130. • https://www.qualcomm.com/company/product-security/bulletins • CWE-284: Improper Access Control •