CVE-2023-33021 – Use After Free in Graphics
https://notcve.org/view.php?id=CVE-2023-33021
Memory corruption in Graphics while processing user packets for command submission. Corrupción de la memoria en Graphics al procesar paquetes de usuario para el envío de comandos. • https://www.qualcomm.com/company/product-security/bulletins/september-2023-bulletin • CWE-416: Use After Free •
CVE-2023-22667 – Integer Overflow or Wraparound in Audio
https://notcve.org/view.php?id=CVE-2023-22667
Memory Corruption in Audio while allocating the ion buffer during the music playback. • https://www.qualcomm.com/company/product-security/bulletins/july-2023-bulletin • CWE-190: Integer Overflow or Wraparound •
CVE-2023-21629 – Double Free in Modem
https://notcve.org/view.php?id=CVE-2023-21629
Memory Corruption in Modem due to double free while parsing the PKCS15 sim files. • https://www.qualcomm.com/company/product-security/bulletins/july-2023-bulletin • CWE-415: Double Free •
CVE-2019-10530
https://notcve.org/view.php?id=CVE-2019-10530
Lack of check of data truncation on user supplied data in kernel leads to buffer overflow in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, SD 210/SD 212/SD 205, SD 425, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24 Una falta de comprobación del truncamiento de datos en los datos suministrados por parte del usuario en el kernel conlleva a un desbordamiento del búfer en los productos Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en las versiones MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, SD 210/SD 212/SD 205, SD 425, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24. • https://source.android.com/security/bulletin/pixel/2019-11-01 • CWE-190: Integer Overflow or Wraparound •
CVE-2019-2332
https://notcve.org/view.php?id=CVE-2019-2332
Memory corruption while accessing the memory as payload size is not validated before access in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 600, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24 Una corrupción de la memoria al acceder a la memoria ya que el tamaño de la carga útil no se comprueba antes del acceso en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en las versiones MDM9150, MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 600, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24. • https://source.android.com/security/bulletin • CWE-787: Out-of-bounds Write •