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CVSS: 7.8EPSS: 0%CPEs: 562EXPL: 0

Memory corruption in DSP Services during a remote call from HLOS to DSP. Corrupción de la memoria en los servicios DSP durante una llamada remota de HLOS a DSP. Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-416: Use After Free •

CVSS: 7.5EPSS: 0%CPEs: 428EXPL: 2

Transient DOS in Bluetooth Host while rfc slot allocation. DOS transitorio en el host Bluetooth mientras se asigna la ranura RFC. • https://github.com/Trinadh465/CVE-2023-28588 https://github.com/uthrasri/CVE-2023-28588 https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-190: Integer Overflow or Wraparound •

CVSS: 7.8EPSS: 0%CPEs: 560EXPL: 0

Memory Corruption in SPS Application while exporting public key in sorter TA. Corrupción de la memoria en la aplicación SPS al exportar la clave pública en el clasificador TA. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-120: Buffer Copy without Checking Size of Input ('Classic Buffer Overflow') •

CVSS: 7.8EPSS: 0%CPEs: 518EXPL: 0

Memory corruption in Audio while processing the VOC packet data from ADSP. Corrupción de la memoria en Audio mientras se procesan los datos del paquete VOC desde ADSP. • https://www.qualcomm.com/company/product-security/bulletins/november-2023-bulletin • CWE-191: Integer Underflow (Wrap or Wraparound) CWE-787: Out-of-bounds Write •

CVSS: 7.8EPSS: 0%CPEs: 412EXPL: 0

Memory Corruption in HLOS while importing a cryptographic key into KeyMaster Trusted Application. Corrupción de la memoria en HLOS al importar una clave criptográfica en la aplicación de confianza KeyMaster. • https://www.qualcomm.com/company/product-security/bulletins/october-2023-bulletin • CWE-129: Improper Validation of Array Index •