CVSS: 7.1EPSS: 0%CPEs: 622EXPL: 0CVE-2024-21462 – Buffer Over-read in TZ Secure OS
https://notcve.org/view.php?id=CVE-2024-21462
Transient DOS while loading the TA ELF file. DOS transitorio mientras se carga el archivo TA ELF. • https://docs.qualcomm.com/product/publicresources/securitybulletin/july-2024-bulletin.html • CWE-125: Out-of-bounds Read CWE-126: Buffer Over-read •
CVSS: 8.4EPSS: 0%CPEs: 626EXPL: 0CVE-2024-21461 – Double Free in HLOS
https://notcve.org/view.php?id=CVE-2024-21461
Memory corruption while performing finish HMAC operation when context is freed by keymaster. Corrupción de la memoria al realizar la operación de finalización de HMAC cuando Keymaster libera el contexto. • https://docs.qualcomm.com/product/publicresources/securitybulletin/july-2024-bulletin.html • CWE-415: Double Free •
CVSS: 7.5EPSS: 0%CPEs: 732EXPL: 0CVE-2023-33080 – Buffer over-read in WLAN Firmware
https://notcve.org/view.php?id=CVE-2023-33080
Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. DOS transitorio mientras se analiza un IE (elemento de información) específico del fabricante del frame de gestión de respuesta de reasociación. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-125: Out-of-bounds Read CWE-126: Buffer Over-read •
CVSS: 7.8EPSS: 0%CPEs: 288EXPL: 0CVE-2023-33079 – Use of Out-of-range Pointer Offset in Audio
https://notcve.org/view.php?id=CVE-2023-33079
Memory corruption in Audio while running invalid audio recording from ADSP. Corrupción de la memoria en audio mientras se ejecuta una grabación de audio no válida desde ADSP. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-119: Improper Restriction of Operations within the Bounds of a Memory Buffer CWE-823: Use of Out-of-range Pointer Offset •
CVSS: 7.8EPSS: 0%CPEs: 562EXPL: 0CVE-2023-33063 – Qualcomm Multiple Chipsets Use-After-Free Vulnerability
https://notcve.org/view.php?id=CVE-2023-33063
Memory corruption in DSP Services during a remote call from HLOS to DSP. Corrupción de la memoria en los servicios DSP durante una llamada remota de HLOS a DSP. Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-416: Use After Free •