CVE-2023-21628 – Buffer Copy Without Checking Size of Input (`Classic Buffer Overflow`) in WLAN HAL
https://notcve.org/view.php?id=CVE-2023-21628
Memory corruption in WLAN HAL while processing WMI-UTF command or FTM TLV1 command. • https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin • CWE-119: Improper Restriction of Operations within the Bounds of a Memory Buffer CWE-787: Out-of-bounds Write •
CVE-2019-2275
https://notcve.org/view.php?id=CVE-2019-2275
While deserializing any key blob during key operations, buffer overflow could occur exposing partial key information if any key operations are invoked(Depends on CVE-2018-13907) in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in MDM9150, MDM9205, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130 Mientras se deserializa cualquier blob de teclas durante las operaciones de clave, puede presentarse un desbordamiento de búfer que expone información de clave parcial si cualquier operación clave es invocada (depende de el CVE-2018-13907) en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking en las versiones MDM9150, MDM9205, MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS404, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130. • https://www.qualcomm.com/company/product-security/bulletins • CWE-119: Improper Restriction of Operations within the Bounds of a Memory Buffer •
CVE-2019-2258
https://notcve.org/view.php?id=CVE-2019-2258
Improper validation of array index causes OOB write and then leads to memory corruption in MMCP in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, SDX20, Snapdragon_High_Med_2016, SXR1130 Una comprobación inapropiada del índice de matriz causa la escritura OOB y luego conlleva a una corrupción de la memoria en MMCP en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en las versiones MDM9150, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, SDX20, Snapdragon_High_Med_2016, SXR1130. • https://source.android.com/security/bulletin • CWE-129: Improper Validation of Array Index CWE-787: Out-of-bounds Write •
CVE-2019-10504
https://notcve.org/view.php?id=CVE-2019-10504
Firmware not able to send EXT scan response to host within 1 sec due to resource consumption issue in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables in MDM9206, MDM9607, MSM8909W, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 665, SD 845 / SD 850, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016 El firmware noes capaz de enviar una respuesta de escaneo EXT hacia el host en 1 segundo debido a un problema de consumo de recursos en los productos Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables in MDM9206, MDM9607, MSM8909W, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 665, SD 845 / SD 850, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016. • https://source.android.com/security/bulletin • CWE-400: Uncontrolled Resource Consumption •
CVE-2019-2294
https://notcve.org/view.php?id=CVE-2019-2294
Usage of hard-coded magic number for calculating heap guard bytes can allow users to corrupt heap blocks without heap algorithm knowledge in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9205, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9655, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130 El uso de un número mágico embebido para calcular los bytes de protección de la pila puede permitir a los usuarios corromper los bloques de la pila sin el conocimiento del algoritmo de la misma en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en las versiones MDM9205, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9655, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130 • https://www.qualcomm.com/company/product-security/bulletins • CWE-330: Use of Insufficiently Random Values •