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CVSS: 7.5EPSS: 0%CPEs: 322EXPL: 0

Transient DOS due to buffer over-read in WLAN while parsing corrupted NAN frames. • https://www.qualcomm.com/company/product-security/bulletins/january-2023-bulletin • CWE-125: Out-of-bounds Read •

CVSS: 8.2EPSS: 0%CPEs: 322EXPL: 0

Information disclosure due to buffer over-read in WLAN while handling IBSS beacons frame. • https://www.qualcomm.com/company/product-security/bulletins/january-2023-bulletin • CWE-125: Out-of-bounds Read •

CVSS: 6.0EPSS: 0%CPEs: 156EXPL: 0

Information exposure in DSP services due to improper handling of freeing memory Exposición de información en servicios DSP por manejo inadecuado de liberación de memoria • https://www.qualcomm.com/company/product-security/bulletins/january-2023-bulletin • CWE-416: Use After Free •

CVSS: 7.5EPSS: 0%CPEs: 568EXPL: 0

Transient DOS due to loop with unreachable exit condition in WLAN while processing an incoming FTM frames. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking DOS transitorio debido a un bucle con condición de salida inalcanzable en WLAN mientras se procesan tramas FTM entrantes. en Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking • https://www.qualcomm.com/company/product-security/bulletins/december-2022-bulletin • CWE-835: Loop with Unreachable Exit Condition ('Infinite Loop') •

CVSS: 7.8EPSS: 0%CPEs: 286EXPL: 0

Memory corruption in diag due to use after free while processing dci packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Corrupción de la memoria en diagnóstico debido al use-after-free mientras se procesa el paquete dci en Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking • https://www.qualcomm.com/company/product-security/bulletins/december-2022-bulletin • CWE-416: Use After Free •