CVSS: 7.8EPSS: 0%CPEs: 798EXPL: 0CVE-2020-11261 – Qualcomm Multiple Chipsets Improper Input Validation Vulnerability
https://notcve.org/view.php?id=CVE-2020-11261
Memory corruption due to improper check to return error when user application requests memory allocation of a huge size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Una corrupción de la memoria debido a una comprobación inapropiada para devolver el error cuando la aplicación del usuario pida una asignación de memoria de un tamaño enorme en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin • CWE-20: Improper Input Validation •
CVSS: 7.8EPSS: 0%CPEs: 852EXPL: 0CVE-2020-11241
https://notcve.org/view.php?id=CVE-2020-11241
Out of bound read will happen if EAPOL Key length is less than expected while processing NAN shared key descriptor attribute in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking Una lectura fuera de límites ocurrirá si la longitud de la clave EAPOL es menor de lo esperado mientras se procesa el atributo de descriptor de clave compartida NAN en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking • https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin • CWE-125: Out-of-bounds Read •
CVSS: 7.8EPSS: 0%CPEs: 812EXPL: 0CVE-2020-11239 – Qualcomm kgsl Driver Use-After-Free
https://notcve.org/view.php?id=CVE-2020-11239
Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Un uso de la memoria previamente liberada al importar un búfer DMA usando la dirección de CPU del búfer debido a que el archivo adjunto no se limpia correctamente en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin • CWE-416: Use After Free •
CVSS: 7.0EPSS: 0%CPEs: 224EXPL: 0CVE-2020-11233
https://notcve.org/view.php?id=CVE-2020-11233
Time-of-check time-of-use race condition While processing partition entries due to newly created buffer was read again from mmc without validation in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Una condición de carrera de Time-of-check time-of-use mientras se procesaban las entradas de la partición debido al búfer recién diseñado, se volvió a leer desde mmc sin comprobación en los productos Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin • CWE-367: Time-of-check Time-of-use (TOCTOU) Race Condition •
CVSS: 7.8EPSS: 0%CPEs: 1076EXPL: 0CVE-2020-11235
https://notcve.org/view.php?id=CVE-2020-11235
Buffer overflow might occur while parsing unified command due to lack of check of input data received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking Un desbordamiento del búfer puede ocurrir cuando se analiza un comando unificado debido a una falta de comprobación de los datos de entrada recibidos en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking • https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin • CWE-190: Integer Overflow or Wraparound •