Page 24 of 248 results (0.007 seconds)

CVSS: 10.0EPSS: 0%CPEs: 240EXPL: 0

CVE-2021-30341

https://notcve.org/view.php?id=CVE-2021-30341

Improper buffer size validation of DSM packet received can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables Una comprobación inapropiada del tamaño del búfer del paquete DSM recibido puede conllevar a una corrupción de la memoria en Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletin • CWE-787: Out-of-bounds Write •

CVSS: 7.8EPSS: 0%CPEs: 106EXPL: 0

CVE-2021-30340

https://notcve.org/view.php?id=CVE-2021-30340

Reachable assertion due to improper validation of coreset in PDCCH configuration in SA mode in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile Una Aserción alcanzable debido a una comprobación inapropiada del conjunto de núcleos en la configuración PDCCH en el modo SA en Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile • https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletin • CWE-617: Reachable Assertion •

CVSS: 9.0EPSS: 0%CPEs: 110EXPL: 0

CVE-2021-30339

https://notcve.org/view.php?id=CVE-2021-30339

Reading PRNG output may lead to improper key generation due to lack of buffer validation in Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Una lectura de la salida del PRNG puede conllevar a una generación incorrecta de claves debido a una falta de comprobación del búfer en Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking • https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletin •

CVSS: 8.4EPSS: 0%CPEs: 262EXPL: 0

CVE-2021-30334

https://notcve.org/view.php?id=CVE-2021-30334

Possible use after free due to lack of null check of DRM file status after file structure is freed in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables Un posible uso de memoria previamente liberada debido a una falta de comprobación nula del estado del archivo DRM después de la liberación de la estructura del archivo en Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletin • CWE-416: Use After Free •

CVSS: 8.4EPSS: 0%CPEs: 180EXPL: 0

CVE-2022-22071 – Qualcomm Multiple Chipsets Use-After-Free Vulnerability

https://notcve.org/view.php?id=CVE-2022-22071

Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music Un posible uso de memoria previamente liberada cuando la memoria shell del proceso es liberada mediante la llamada IOCTL munmap y la inicialización del proceso está en curso en Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music Multiple Qualcomm chipsets contain a use-after-free vulnerability when process shell memory is freed using IOCTL munmap call and process initialization is in progress. • https://www.qualcomm.com/company/product-security/bulletins/may-2022-bulletin • CWE-416: Use After Free •