CVSS: 8.4EPSS: 0%CPEs: 794EXPL: 0CVE-2021-1905 – Qualcomm Multiple Chipsets Use-After-Free Vulnerability
https://notcve.org/view.php?id=CVE-2021-1905
Possible use after free due to improper handling of memory mapping of multiple processes simultaneously. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Un posible uso de la memoria previamente liberada debido a un manejo inapropiado de la asignación de la memoria de múltiples procesos simultáneamente. en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Multiple Qualcomm Chipsets contain a use after free vulnerability due to improper handling of memory mapping of multiple processes simultaneously. • https://www.qualcomm.com/company/product-security/bulletins/may-2021-bulletin • CWE-416: Use After Free •
CVSS: 6.2EPSS: 0%CPEs: 802EXPL: 0CVE-2021-1906 – Qualcomm Multiple Chipsets Detection of Error Condition Without Action Vulnerability
https://notcve.org/view.php?id=CVE-2021-1906
Improper handling of address deregistration on failure can lead to new GPU address allocation failure. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Un manejo inapropiado de la cancelación del registro de direcciones en caso de fallo puede conllevar a un fallo en la asignación de direcciones de la nueva GPU. En los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Multiple Qualcomm chipsets contain a detection of error condition without action vulnerability when improper handling of address deregistration on failure can lead to new GPU address allocation failure. • https://www.qualcomm.com/company/product-security/bulletins/may-2021-bulletin • CWE-755: Improper Handling of Exceptional Conditions •
CVSS: 9.4EPSS: 0%CPEs: 802EXPL: 0CVE-2020-11285
https://notcve.org/view.php?id=CVE-2020-11285
Buffer over-read while unpacking the RTCP packet we may read extra byte if wrong length is provided in RTCP packets in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Una lectura excesiva del búfer mientras desempaquetamos el paquete RTCP, podemos leer un byte adicional si es proporcionada una longitud inapropiada en los paquetes RTCP en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/may-2021-bulletin • CWE-125: Out-of-bounds Read •
CVSS: 10.0EPSS: 0%CPEs: 818EXPL: 0CVE-2020-11279
https://notcve.org/view.php?id=CVE-2020-11279
Memory corruption while processing crafted SDES packets due to improper length check in sdes packets recieved in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Una corrupción de la memoria durante el procesamiento de paquetes SDES diseñados debido a una comprobación inapropiada de longitud en los paquetes sdes recibidos en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/may-2021-bulletin • CWE-190: Integer Overflow or Wraparound •
CVSS: 7.8EPSS: 0%CPEs: 692EXPL: 0CVE-2020-11255
https://notcve.org/view.php?id=CVE-2020-11255
Denial of service while processing RTCP packets containing multiple SDES reports due to memory for last SDES packet is freed and rest of the memory is leaked in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables Una denegación de servicio mientras se procesan paquetes RTCP que contienen múltiples reportes SDES debido a que la memoria del último paquete SDES es liberada y el resto de la memoria es filtrada en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/april-2021-bulletin • CWE-401: Missing Release of Memory after Effective Lifetime •