CVE-2020-11233
https://notcve.org/view.php?id=CVE-2020-11233
Time-of-check time-of-use race condition While processing partition entries due to newly created buffer was read again from mmc without validation in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Una condición de carrera de Time-of-check time-of-use mientras se procesaban las entradas de la partición debido al búfer recién diseñado, se volvió a leer desde mmc sin comprobación en los productos Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin • CWE-367: Time-of-check Time-of-use (TOCTOU) Race Condition •
CVE-2020-11235
https://notcve.org/view.php?id=CVE-2020-11235
Buffer overflow might occur while parsing unified command due to lack of check of input data received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking Un desbordamiento del búfer puede ocurrir cuando se analiza un comando unificado debido a una falta de comprobación de los datos de entrada recibidos en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking • https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin • CWE-190: Integer Overflow or Wraparound •
CVE-2020-11159
https://notcve.org/view.php?id=CVE-2020-11159
Buffer over-read can happen while processing WPA,RSN IE of beacon and response frames if IE length is less than length of frame pointer being accessed in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking Una sobrelectura del búfer puede ocurrir mientras se procesa WPA, RSN IE de la baliza y las tramas de respuesta si la longitud del IE es menor que la longitud del puntero dla trama al que se accede en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking • https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin • CWE-125: Out-of-bounds Read •
CVE-2021-1910
https://notcve.org/view.php?id=CVE-2021-1910
Double free in video due to lack of input buffer length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Una doble liberación en video debido a una falta de comprobación de la longitud del búfer de la entrada en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/may-2021-bulletin • CWE-415: Double Free •
CVE-2021-1905 – Qualcomm Multiple Chipsets Use-After-Free Vulnerability
https://notcve.org/view.php?id=CVE-2021-1905
Possible use after free due to improper handling of memory mapping of multiple processes simultaneously. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Un posible uso de la memoria previamente liberada debido a un manejo inapropiado de la asignación de la memoria de múltiples procesos simultáneamente. en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Multiple Qualcomm Chipsets contain a use after free vulnerability due to improper handling of memory mapping of multiple processes simultaneously. • https://www.qualcomm.com/company/product-security/bulletins/may-2021-bulletin • CWE-416: Use After Free •