CVSS: 6.2EPSS: 0%CPEs: 802EXPL: 0CVE-2021-1906 – Qualcomm Multiple Chipsets Detection of Error Condition Without Action Vulnerability
https://notcve.org/view.php?id=CVE-2021-1906
Improper handling of address deregistration on failure can lead to new GPU address allocation failure. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Un manejo inapropiado de la cancelación del registro de direcciones en caso de fallo puede conllevar a un fallo en la asignación de direcciones de la nueva GPU. En los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Multiple Qualcomm chipsets contain a detection of error condition without action vulnerability when improper handling of address deregistration on failure can lead to new GPU address allocation failure. • https://www.qualcomm.com/company/product-security/bulletins/may-2021-bulletin • CWE-755: Improper Handling of Exceptional Conditions •
CVSS: 7.8EPSS: 0%CPEs: 994EXPL: 0CVE-2020-11289
https://notcve.org/view.php?id=CVE-2020-11289
Out of bound write can occur in TZ command handler due to lack of validation of command ID in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Una escritura fuera de límite puede ocurrir en el controlador de comandos TZ debido a una falta de comprobación de la ID del comando en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Infraestructura y redes cableadas de Snapdragon • https://www.qualcomm.com/company/product-security/bulletins/may-2021-bulletin • CWE-119: Improper Restriction of Operations within the Bounds of a Memory Buffer •
CVSS: 6.0EPSS: 0%CPEs: 680EXPL: 0CVE-2020-11293
https://notcve.org/view.php?id=CVE-2020-11293
Out of bound read can happen in Widevine TA while copying data to buffer from user data due to lack of check of buffer length received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Una lectura fuera del límite puede ocurrir en Widevine TA mientras son copiados datos al búfer de los datos del usuario debido a una falta de comprobación de la longitud del búfer recibida en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Infraestructura cableada Snapdragon y redes • https://www.qualcomm.com/company/product-security/bulletins/may-2021-bulletin • CWE-125: Out-of-bounds Read •
CVSS: 9.4EPSS: 0%CPEs: 802EXPL: 0CVE-2020-11285
https://notcve.org/view.php?id=CVE-2020-11285
Buffer over-read while unpacking the RTCP packet we may read extra byte if wrong length is provided in RTCP packets in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Una lectura excesiva del búfer mientras desempaquetamos el paquete RTCP, podemos leer un byte adicional si es proporcionada una longitud inapropiada en los paquetes RTCP en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/may-2021-bulletin • CWE-125: Out-of-bounds Read •
CVSS: 10.0EPSS: 0%CPEs: 818EXPL: 0CVE-2020-11279
https://notcve.org/view.php?id=CVE-2020-11279
Memory corruption while processing crafted SDES packets due to improper length check in sdes packets recieved in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Una corrupción de la memoria durante el procesamiento de paquetes SDES diseñados debido a una comprobación inapropiada de longitud en los paquetes sdes recibidos en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/may-2021-bulletin • CWE-190: Integer Overflow or Wraparound •