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CVSS: 7.8EPSS: 0%CPEs: 34EXPL: 0

CVE-2017-18278

https://notcve.org/view.php?id=CVE-2017-18278

An integer underflow may occur due to lack of check when received data length from font_mgr_qsee_request_service is bigger than the minimal value of the segment header, which may result in a buffer overflow, in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850. Puede producirse un subdesbordamiento de enteros debido a la falta de comprobación cuando la longitud de los datos recibidos de font_mgr_qsee_request_service es mayor que el valor mínimo de la cabecera de segmento, lo que puede dar lugar a un desbordamiento del búfer, en Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear en MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850. • https://www.qualcomm.com/company/product-security/bulletins • CWE-191: Integer Underflow (Wrap or Wraparound) •

CVSS: 5.5EPSS: 0%CPEs: 42EXPL: 0

CVE-2017-18275

https://notcve.org/view.php?id=CVE-2017-18275

A new account can be inserted into simContacts service using Android command line tool in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845. Se puede insertar una nueva cuenta en el servicio simContacts utilizando la herramienta de línea de comandos Android en Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear en MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845. • https://www.qualcomm.com/company/product-security/bulletins •

CVSS: 7.8EPSS: 0%CPEs: 32EXPL: 0

CVE-2017-18274

https://notcve.org/view.php?id=CVE-2017-18274

While iterating through the models contained in a fixed-size array in the actData structure, which also stores an incorrect number of models that is greater than the size of the array, a buffer overflow occurs in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835 Al iterar a través de los modelos contenidos en un array de tamaño fijo en la estructura actData, que también almacena un número incorrecto de modelos mayor que el tamaño del array, se produce un desbordamiento de búfer en Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear en MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835 • https://www.qualcomm.com/company/product-security/bulletins • CWE-129: Improper Validation of Array Index •

CVSS: 7.8EPSS: 0%CPEs: 26EXPL: 0

CVE-2017-18173

https://notcve.org/view.php?id=CVE-2017-18173

In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016. En caso de utilizar una firma de arranque verificada por Android no válida con una longitud muy grande, se produce un subdesbordamiento de enteros en Snapdragon Mobile en SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016. • https://www.qualcomm.com/company/product-security/bulletins • CWE-190: Integer Overflow or Wraparound •

CVSS: 7.8EPSS: 0%CPEs: 42EXPL: 0

CVE-2017-18157

https://notcve.org/view.php?id=CVE-2017-18157

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20. Una condición de uso después de liberar la memoria puede ocurrir en Thermal Engine en Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear en MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20. • https://www.qualcomm.com/company/product-security/bulletins • CWE-416: Use After Free •