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CVSS: 7.8EPSS: 0%CPEs: 72EXPL: 0

CVE-2017-18124

https://notcve.org/view.php?id=CVE-2017-18124

During secure boot, addition is performed on uint8 ptrs which led to overflow issue in Small Cell SoC, Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version FSM9055, IPQ4019, MDM9206, MDM9607, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDX20 Durante el arranque seguro, se realiza una suma en uint8 ptrs, lo que conduce a un problema de desbordamiento en Small Cell SoC, Snapdragon Automobile, Snapdragon Mobile y Snapdragon Wear en versiones FSM9055, IPQ4019, MDM9206, MDM9607, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660 y SDX20. • https://www.qualcomm.com/company/product-security/bulletins • CWE-119: Improper Restriction of Operations within the Bounds of a Memory Buffer •

CVSS: 7.8EPSS: 0%CPEs: 70EXPL: 0

CVE-2018-11269

https://notcve.org/view.php?id=CVE-2018-11269

In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options. En Snapdragon (Automobile, Mobile y Wear) en versiones MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20 y Snapdragon_High_Med_2016, existe un potencial desbordamiento de búfer al analizar opciones TFTP. • http://www.securityfocus.com/bid/105838 https://www.qualcomm.com/company/product-security/bulletins • CWE-129: Improper Validation of Array Index •

CVSS: 7.8EPSS: 0%CPEs: 78EXPL: 0

CVE-2018-11267

https://notcve.org/view.php?id=CVE-2018-11267

In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20. En Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20 y Snapdragon_High_Med_2016, al enviar datos XML mal formados a deviceprogrammer/firehose se podría provocar una escritura al búfer fuera de límites, lo que permitiría que se escriba en una región de memoria con 0x20. • http://www.securityfocus.com/bid/106128 https://www.qualcomm.com/company/product-security/bulletins • CWE-129: Improper Validation of Array Index •

CVSS: 8.8EPSS: 0%CPEs: 56EXPL: 0

CVE-2018-11982

https://notcve.org/view.php?id=CVE-2018-11982

In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure. En Snapdragon (Mobile y Wear) en versiones MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835 y Snapdragon_High_Med_2016, ocurre una doble liberación (double free) de la memoria dinámica (heap) de ASN1 empleada para el contenedor EUTRA CAP durante el procedimiento de consulta UTRAN to LTE Capability. • https://www.qualcomm.com/company/product-security/bulletins • CWE-415: Double Free •

CVSS: 10.0EPSS: 0%CPEs: 74EXPL: 0

CVE-2017-18314

https://notcve.org/view.php?id=CVE-2017-18314

In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ. En Snapdragon (Automobile, Mobile y Wear) en versiones MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660 y Snapdragon_High_Med_2016, en TZ se podría arrancar CNOC_QDSS RG0 bloqueado por xBL_SEC al ser limpiado por TZ. • https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components https://www.qualcomm.com/company/product-security/bulletins •