CVE-2023-33083 – Buffer Copy Without Checking Size of Input (`Classic Buffer Overflow`) in WLAN Host
https://notcve.org/view.php?id=CVE-2023-33083
Memory corruption in WLAN Host while processing RRM beacon on the AP. Corrupción de la memoria en el host WLAN mientras se procesa beacon RRM en el AP. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-120: Buffer Copy without Checking Size of Input ('Classic Buffer Overflow') •
CVE-2023-33082 – Buffer Copy Without Checking Size of Input (`Classic Buffer Overflow`) in WLAN Host
https://notcve.org/view.php?id=CVE-2023-33082
Memory corruption while sending an Assoc Request having BTM Query or BTM Response containing MBO IE. Corrupción de la memoria al enviar una solicitud de asociación con una consulta BTM o una respuesta BTM que contiene MBO IE. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-120: Buffer Copy without Checking Size of Input ('Classic Buffer Overflow') •
CVE-2023-33081 – Buffer over-read in WLAN Firmware
https://notcve.org/view.php?id=CVE-2023-33081
Transient DOS while converting TWT (Target Wake Time) frame parameters in the OTA broadcast. DOS transitorio al convertir parámetros de fotograma TWT (Target Wake Time) en la transmisión OTA. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-125: Out-of-bounds Read CWE-126: Buffer Over-read •
CVE-2023-33080 – Buffer over-read in WLAN Firmware
https://notcve.org/view.php?id=CVE-2023-33080
Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. DOS transitorio mientras se analiza un IE (elemento de información) específico del fabricante del frame de gestión de respuesta de reasociación. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-125: Out-of-bounds Read CWE-126: Buffer Over-read •
CVE-2023-33063 – Qualcomm Multiple Chipsets Use-After-Free Vulnerability
https://notcve.org/view.php?id=CVE-2023-33063
Memory corruption in DSP Services during a remote call from HLOS to DSP. Corrupción de la memoria en los servicios DSP durante una llamada remota de HLOS a DSP. Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-416: Use After Free •