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CVSS: 7.8EPSS: 0%CPEs: 812EXPL: 0

Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Un uso de la memoria previamente liberada al importar un búfer DMA usando la dirección de CPU del búfer debido a que el archivo adjunto no se limpia correctamente en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin • CWE-416: Use After Free •

CVSS: 7.0EPSS: 0%CPEs: 224EXPL: 0

Time-of-check time-of-use race condition While processing partition entries due to newly created buffer was read again from mmc without validation in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Una condición de carrera de Time-of-check time-of-use mientras se procesaban las entradas de la partición debido al búfer recién diseñado, se volvió a leer desde mmc sin comprobación en los productos Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin • CWE-367: Time-of-check Time-of-use (TOCTOU) Race Condition •

CVSS: 7.8EPSS: 0%CPEs: 1076EXPL: 0

Buffer overflow might occur while parsing unified command due to lack of check of input data received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking Un desbordamiento del búfer puede ocurrir cuando se analiza un comando unificado debido a una falta de comprobación de los datos de entrada recibidos en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking • https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin • CWE-190: Integer Overflow or Wraparound •

CVSS: 7.1EPSS: 0%CPEs: 452EXPL: 0

Out-of-bounds memory access can occur while calculating alignment requirements for a negative width from external components in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music Un acceso a la memoria fuera de límites puede ocurrir mientras se calculan los requisitos de alineación para un ancho negativo de componentes externos en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music • https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin • CWE-125: Out-of-bounds Read •

CVSS: 9.4EPSS: 0%CPEs: 1006EXPL: 0

Buffer over-read can happen while processing WPA,RSN IE of beacon and response frames if IE length is less than length of frame pointer being accessed in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking Una sobrelectura del búfer puede ocurrir mientras se procesa WPA, RSN IE de la baliza y las tramas de respuesta si la longitud del IE es menor que la longitud del puntero dla trama al que se accede en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking • https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin • CWE-125: Out-of-bounds Read •