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CVSS: 9.8EPSS: 2%CPEs: 14EXPL: 1

CVE-2020-11117

https://notcve.org/view.php?id=CVE-2020-11117

u'In the lbd service, an external user can issue a specially crafted debug command to overwrite arbitrary files with arbitrary content resulting in remote code execution.' in Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Wired Infrastructure and Networking in IPQ4019, IPQ6018, IPQ8064, IPQ8074, QCA4531, QCA9531, QCA9980 En el servicio lbd, un usuario externo puede emitir un comando de depuración especialmente diseñado para sobrescribir archivos arbitrarios con contenido arbitrario resultando en una ejecución de código remota. En los productos Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Wired Infrastructure and Networking en versiones IPQ4019, IPQ6018, IPQ8064, IPQ8074, QCA4531, QCA9531, QCA9980 • https://www.qualcomm.com/company/product-security/bulletins/august-2020-bulletin https://www.talosintelligence.com/vulnerability_reports/TALOS-2020-1065 • CWE-77: Improper Neutralization of Special Elements used in a Command ('Command Injection') •

CVSS: 7.0EPSS: 0%CPEs: 50EXPL: 0

CVE-2019-14119

https://notcve.org/view.php?id=CVE-2019-14119

u'While processing SMCInvoke asynchronous message header, message count is modified leading to a TOCTOU race condition and lead to memory corruption' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in IPQ6018, Kamorta, MDM9205, MDM9607, Nicobar, QCS404, QCS405, QCS605, QCS610, Rennell, SA415M, SA515M, SA6155P, SC7180, SC8180X, SDM670, SDM710, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 Mientras se procesa el encabezado del mensaje asíncrono de SMCInvoke, el conteo de mensajes es modificado, conllevando a una condición de carrera TOCTOU y conlleva a una corrupción de la memoria en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking en versiones IPQ6018, Kamorta, MDM9205, MDM9607, Nicobar, QCS404, QCS405, QCS605, QCS610, Rennell, SA415M, SA515M, SA6155P, SC7180, SC8180X, SDM670, SDM710, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 • https://www.qualcomm.com/company/product-security/bulletins/august-2020-bulletin https://www.qualcomm.com/company/product-security/bulletins/august-2020-security-bulletin • CWE-367: Time-of-check Time-of-use (TOCTOU) Race Condition CWE-787: Out-of-bounds Write •

CVSS: 7.8EPSS: 0%CPEs: 140EXPL: 0

CVE-2019-14074

https://notcve.org/view.php?id=CVE-2019-14074

u'Heap overflow in diag command handler due to lack of check of packet length received from user' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8076, APQ8096AU, APQ8098, Bitra, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9207C, MDM9607, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA6155P, Saipan, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 Un desbordamiento de la pila en el manejador de comandos diag debido a una falta de comprobación de la longitud del paquete recibido del usuario en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking en versiones APQ8009, APQ8017, APQ8053, APQ8076, APQ8096AU, APQ8098, Bitra, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9207C, MDM9607, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA6155P, Saipan, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 • https://www.qualcomm.com/company/product-security/bulletins/august-2020-bulletin https://www.qualcomm.com/company/product-security/bulletins/august-2020-security-bulletin • CWE-20: Improper Input Validation CWE-190: Integer Overflow or Wraparound CWE-787: Out-of-bounds Write •

CVSS: 7.8EPSS: 0%CPEs: 128EXPL: 0

CVE-2019-13999

https://notcve.org/view.php?id=CVE-2019-13999

u'Lack of check for integer overflow for round up and addition operations result into memory corruption and potential information leakage' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA515M, SA6155P, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 Una falta de comprobación del desbordamiento de enteros para operaciones de redondeo y suma resulta en una corrupción de la memoria y un potencial filtrado de información en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking en versiones APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA515M, SA6155P, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 • https://www.qualcomm.com/company/product-security/bulletins/august-2020-bulletin https://www.qualcomm.com/company/product-security/bulletins/august-2020-security-bulletin • CWE-190: Integer Overflow or Wraparound CWE-787: Out-of-bounds Write •

CVSS: 7.8EPSS: 0%CPEs: 130EXPL: 0

CVE-2019-13998

https://notcve.org/view.php?id=CVE-2019-13998

u'Lack of check that the TX FIFO write and read indices that are read from shared RAM are less than the FIFO size results into memory corruption and potential information leakage' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, Bitra, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA515M, SA6155P, Saipan, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 Una falta de comprobación de que los índices de escritura y lectura TX FIFO que son leídos desde la RAM compartida sean menores que el tamaño de FIFO resulta en una corrupción de la memoria y un potencial filtrado de información en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking en versiones APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, Bitra, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA515M, SA6155P, Saipan, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 • https://www.qualcomm.com/company/product-security/bulletins/august-2020-bulletin https://www.qualcomm.com/company/product-security/bulletins/august-2020-security-bulletin • CWE-190: Integer Overflow or Wraparound CWE-787: Out-of-bounds Write •