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CVSS: 7.8EPSS: 0%CPEs: 50EXPL: 0

CVE-2019-14027

https://notcve.org/view.php?id=CVE-2019-14027

Buffer overflow due to lack of upper bound check on channel length which is used for a loop. in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in APQ8098, IPQ6018, IPQ8074, MSM8998, Nicobar, QCA8081, QCN7605, QCS404, QCS605, Rennell, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SM6150, SM7150, SM8150, SXR1130, SXR2130 Un desbordamiento del búfer debido a la falta de comprobación del límite superior sobre la longitud del canal que es usado para un bucle. En los productos Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking en las versiones APQ8098, IPQ6018, IPQ8074, MSM8998, Nicobar, QCA8081, QCN7605, QCS404, QCS605, Rennell, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SM6150, SM7150, SM8150, SXR1130, SXR2130. • https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin • CWE-120: Buffer Copy without Checking Size of Input ('Classic Buffer Overflow') •

CVSS: 7.8EPSS: 0%CPEs: 56EXPL: 0

CVE-2019-14015

https://notcve.org/view.php?id=CVE-2019-14015

A stack-based buffer overflow exists in the initialization of the identification stage due to lack of check on the number of templates provided. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8096, APQ8096AU, MDM9205, MSM8996, MSM8996AU, Nicobar, QCS404, QCS405, QCS605, Rennell, SA6155P, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130, SXR2130 Se presenta un desbordamiento del búfer en la región stack de la memoria en la inicialización de la etapa de identificación debido a la falta de comprobación del número de plantillas proporcionadas. En los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking en las versiones APQ8096, APQ8096AU, MDM9205, MSM8996, MSM8996AU, Nicobar, QCS404, QCS405, QCS605, Rennell, SA6155P, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130, SXR2130. • https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin • CWE-787: Out-of-bounds Write •

CVSS: 7.8EPSS: 0%CPEs: 116EXPL: 0

CVE-2019-14000

https://notcve.org/view.php?id=CVE-2019-14000

Lack of check that the RX FIFO write index that is read from shared RAM is less than the FIFO size results into memory corruption and potential information leakage in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, IPQ6018, IPQ8074, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCS404, QCS405, QCS605, QM215, Rennell, SA6155P, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 Una falta de comprobación de que el índice de escritura RX FIFO que se lee desde la memoria RAM compartida es menor que el tamaño de la FIFO, resulta en una corrupción de la memoria y en un potencial filtrado de información en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking en las versiones APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, IPQ6018, IPQ8074, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCS404, QCS405, QCS605, QM215, Rennell, SA6155P, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130. • https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin • CWE-787: Out-of-bounds Write •

CVSS: 7.8EPSS: 0%CPEs: 56EXPL: 0

CVE-2019-10604

https://notcve.org/view.php?id=CVE-2019-10604

Possibility of heap-buffer-overflow during last iteration of loop while populating image version information in diag command response packet, in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in APQ8053, APQ8096AU, APQ8098, MDM9607, MDM9640, MSM8909W, MSM8917, MSM8953, Nicobar, QCS605, QM215, Rennell, SA6155P, Saipan, SDA660, SDM429, SDM439, SDM450, SDM632, SDM670, SDM710, SDM845, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 Una posibilidad de desbordamiento del búfer de la pila durante la última iteración del bucle mientras se llena la información de la versión de la imagen en el paquete de respuesta del comando diag, en los productos Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables en los productos Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables en las versiones APQ8053, APQ8096AU, APQ8098, MDM9607, MDM9640, MSM8909W, MSM8917, MSM8953, Nicobar, QCS605, QM215, Rennell, SA6155P, Saipan, SDA660, SDM429, SDM439, SDM450, SDM632, SDM670, SDM710, SDM845, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 • https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin • CWE-787: Out-of-bounds Write •

CVSS: 10.0EPSS: 0%CPEs: 34EXPL: 0

CVE-2019-10612

https://notcve.org/view.php?id=CVE-2019-10612

UTCB object has a function pointer called by the reaper to deallocate its memory resources and this address can potentially be corrupted by stack overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, MDM9650, QCS605, SA6155P, SC8180X, SDA845, SDM670, SDM710, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 Un objeto UTCB presenta un puntero de función llamado mediante el segador para desasignar sus recursos de la memoria y esta dirección puede ser potencialmente corrompida por el desbordamiento de la pila en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking en las versiones MDM9205, MDM9650, QCS605, SA6155P, SC8180X, SDA845, SDM670, SDM710, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130. • https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin • CWE-787: Out-of-bounds Write •