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CVSS: 7.8EPSS: 0%CPEs: 56EXPL: 0

Possibility of heap-buffer-overflow during last iteration of loop while populating image version information in diag command response packet, in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in APQ8053, APQ8096AU, APQ8098, MDM9607, MDM9640, MSM8909W, MSM8917, MSM8953, Nicobar, QCS605, QM215, Rennell, SA6155P, Saipan, SDA660, SDM429, SDM439, SDM450, SDM632, SDM670, SDM710, SDM845, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 Una posibilidad de desbordamiento del búfer de la pila durante la última iteración del bucle mientras se llena la información de la versión de la imagen en el paquete de respuesta del comando diag, en los productos Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables en los productos Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables en las versiones APQ8053, APQ8096AU, APQ8098, MDM9607, MDM9640, MSM8909W, MSM8917, MSM8953, Nicobar, QCS605, QM215, Rennell, SA6155P, Saipan, SDA660, SDM429, SDM439, SDM450, SDM632, SDM670, SDM710, SDM845, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 • https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin • CWE-787: Out-of-bounds Write •

CVSS: 10.0EPSS: 0%CPEs: 34EXPL: 0

UTCB object has a function pointer called by the reaper to deallocate its memory resources and this address can potentially be corrupted by stack overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, MDM9650, QCS605, SA6155P, SC8180X, SDA845, SDM670, SDM710, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 Un objeto UTCB presenta un puntero de función llamado mediante el segador para desasignar sus recursos de la memoria y esta dirección puede ser potencialmente corrompida por el desbordamiento de la pila en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking en las versiones MDM9205, MDM9650, QCS605, SA6155P, SC8180X, SDA845, SDM670, SDM710, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130. • https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin • CWE-787: Out-of-bounds Write •

CVSS: 10.0EPSS: 0%CPEs: 102EXPL: 0

Buffer overflow can occur when processing non standard SDP video Image attribute parameter in a VILTE\VOLTE call in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8076, APQ8096, APQ8096AU, APQ8098, MDM9150, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, Rennell, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130 Se puede presentar un desbordamiento del búfer cuando se procesa un parámetro de atributo de Imagen de vídeo SDP no estándar en una llamada VILTE\VOLTE en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en las versiones APQ8009, APQ8017, APQ8053, APQ8076, APQ8096, APQ8096AU, APQ8098, MDM9150, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, Rennell, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130. • https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin • CWE-120: Buffer Copy without Checking Size of Input ('Classic Buffer Overflow') •

CVSS: 10.0EPSS: 0%CPEs: 108EXPL: 0

Stack overflow can occur when SDP is received with multiple payload types in the FMTP attribute of a video M line in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8076, APQ8096, APQ8096AU, APQ8098, MDM9150, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, Rennell, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130 Se puede presentar un desbordamiento de la pila cuando es recibido un SDP con múltiples tipos de carga útil en el atributo FMTP de una línea M de vídeo en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en las versiones APQ8009, APQ8017, APQ8053, APQ8076, APQ8096, APQ8096AU, APQ8098, MDM9150, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, Rennell, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130. • https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin • CWE-129: Improper Validation of Array Index CWE-787: Out-of-bounds Write •

CVSS: 10.0EPSS: 0%CPEs: 106EXPL: 0

Possible Stack overflow can occur when processing a large SDP body or non standard SDP body without right delimiters in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, MDM9150, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, Rennell, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130 Se puede presentar un posible desbordamiento de la pila cuando se procesa un cuerpo de SDP grande o un cuerpo de SDP no estándar sin delimitadores correctos en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en las versiones APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, MDM9150, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, Rennell, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130. • https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin • CWE-787: Out-of-bounds Write •