CVSS: 7.8EPSS: 0%CPEs: 812EXPL: 0CVE-2020-11239 – Qualcomm kgsl Driver Use-After-Free
https://notcve.org/view.php?id=CVE-2020-11239
Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Un uso de la memoria previamente liberada al importar un búfer DMA usando la dirección de CPU del búfer debido a que el archivo adjunto no se limpia correctamente en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin • CWE-416: Use After Free •
CVSS: 7.8EPSS: 0%CPEs: 804EXPL: 0CVE-2020-11238
https://notcve.org/view.php?id=CVE-2020-11238
Possible Buffer over-read in ARP/NS parsing due to lack of check of packet length received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking Una posible sobrelectura del búfer en el análisis ARP/NS debido a una falta de comprobación de la longitud del paquete recibido en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking • https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin • CWE-125: Out-of-bounds Read •
CVSS: 7.8EPSS: 0%CPEs: 1076EXPL: 0CVE-2020-11235
https://notcve.org/view.php?id=CVE-2020-11235
Buffer overflow might occur while parsing unified command due to lack of check of input data received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking Un desbordamiento del búfer puede ocurrir cuando se analiza un comando unificado debido a una falta de comprobación de los datos de entrada recibidos en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking • https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin • CWE-190: Integer Overflow or Wraparound •
CVSS: 10.0EPSS: 0%CPEs: 536EXPL: 0CVE-2020-11182
https://notcve.org/view.php?id=CVE-2020-11182
Possible heap overflow while parsing NAL header due to lack of check of length of data received from user in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile Un posible desbordamiento de la pila cuando se analiza el encabezado NAL debido a una falta de comprobación de la longitud de los datos recibidos del usuario en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile • https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin • CWE-787: Out-of-bounds Write •
CVSS: 7.8EPSS: 0%CPEs: 510EXPL: 0CVE-2020-11165
https://notcve.org/view.php?id=CVE-2020-11165
Memory corruption due to buffer overflow while copying the message provided by HLOS into buffer without validating the length of buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking Una corrupción de la memoria debido al desbordamiento del búfer cuando se copia el mensaje proporcionado por HLOS en el búfer sin comprobar la longitud del búfer en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking • https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin • CWE-787: Out-of-bounds Write •