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CVSS: 10.0EPSS: 0%CPEs: 44EXPL: 0

CVE-2015-9216

https://notcve.org/view.php?id=CVE-2015-9216

In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9625, MDM9635M, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 808, and SD 810, improper handling of simultaneous interrupt in USB module during USB RESET and EP COMPLETE. En Android antes del nivel de parcheo de seguridad del 2018-04-05 o antes en Qualcomm Snapdragon Mobile y Snapdragon Wear MDM9206, MDM9607, MDM9625, MDM9635M, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 808 y SD 810, hay una gestión incorrecta de una interrupción simultánea en el módulo USB durante USB RESET y EP COMPLETE. • http://www.securityfocus.com/bid/103671 https://source.android.com/security/bulletin/2018-04-01 •

CVSS: 7.8EPSS: 0%CPEs: 48EXPL: 0

CVE-2015-9217

https://notcve.org/view.php?id=CVE-2015-9217

In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 835, SD 845, SDM630, SDM636, SDM660, and Snapdragon_High_Med_2016, certain malformed HVEC clips could cause an assertion to fail. En Android, antes del nivel de parche de seguridad del 2018-04-05 o antes en Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 835, SD 845, SDM630, SDM636, SDM660 y Snapdragon_High_Med_2016, ciertos clips HVEC malformados pueden hacer que una aserción falle. • http://www.securityfocus.com/bid/103671 https://source.android.com/security/bulletin/2018-04-01 •

CVSS: 5.5EPSS: 0%CPEs: 48EXPL: 0

CVE-2015-9218

https://notcve.org/view.php?id=CVE-2015-9218

In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 835, SD 845, SDM630, SDM636, SDM660, and Snapdragon_High_Med_2016, when processing bad HEVC clips, the DPB fills, and with no error handling for DPB being full, a hang occurs. En Android, antes del nivel de parche de seguridad del 2018-04-05 o antes en Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 835, SD 845, SDM630, SDM636, SDM660 y Snapdragon_High_Med_2016, al procesar clips HEVC malos, el DPB se llena y, al no haber gestión de errores por llenado de DPB, ocurre un bloqueo. • http://www.securityfocus.com/bid/103671 https://source.android.com/security/bulletin/2018-04-01 • CWE-388: 7PK - Errors •

CVSS: 9.3EPSS: 0%CPEs: 18EXPL: 0

CVE-2016-10409

https://notcve.org/view.php?id=CVE-2016-10409

In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Automobile and Snapdragon Mobile SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, and SD 835, TOCTOU vulnerability may occur while composing the RPMB request using HLOS controlled buffers. En Android, antes del nivel de parche de seguridad del 2018-04-05 y antes en Qualcomm Snapdragon Automobile y Snapdragon Mobile SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A y SD 835, podría ocurrir una vulnerabilidad TOCTOU mientras se compone la petición RPMB empleando búfers controlados por HLOS. • http://www.securityfocus.com/bid/103671 https://source.android.com/security/bulletin/2018-04-01 • CWE-362: Concurrent Execution using Shared Resource with Improper Synchronization ('Race Condition') •

CVSS: 10.0EPSS: 0%CPEs: 68EXPL: 0

CVE-2016-10410

https://notcve.org/view.php?id=CVE-2016-10410

In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile and Snapdragon Wear MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850, and SDX20, buffer overflow vulnerability in RTP during Volte call. En Android, antes del nivel de parche de seguridad del 2018-04-05 o antes en Qualcomm Snapdragon Mobile y Snapdragon Wear MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 835, SD 845, SD 850 y SDX20, hay una vulnerabilidad de desbordamiento de búfer en RTP durante una llamada Volte. • http://www.securityfocus.com/bid/103671 https://source.android.com/security/bulletin/2018-04-01 • CWE-119: Improper Restriction of Operations within the Bounds of a Memory Buffer •