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CVSS: 10.0EPSS: 0%CPEs: 818EXPL: 0

Memory corruption while processing crafted SDES packets due to improper length check in sdes packets recieved in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Una corrupción de la memoria durante el procesamiento de paquetes SDES diseñados debido a una comprobación inapropiada de longitud en los paquetes sdes recibidos en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/may-2021-bulletin • CWE-190: Integer Overflow or Wraparound •

CVSS: 8.4EPSS: 0%CPEs: 108EXPL: 0

Memory corruption due to improper input validation while processing IO control which is nonstandard in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Wired Infrastructure and Networking Una corrupción de la memoria debido a una comprobación inapropiada de entrada mientras se procesa el control de IO que no es estándar en los productos Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Wired Infrastructure and Networking • https://www.qualcomm.com/company/product-security/bulletins/april-2021-bulletin • CWE-787: Out-of-bounds Write •

CVSS: 7.8EPSS: 0%CPEs: 692EXPL: 0

Denial of service while processing RTCP packets containing multiple SDES reports due to memory for last SDES packet is freed and rest of the memory is leaked in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables Una denegación de servicio mientras se procesan paquetes RTCP que contienen múltiples reportes SDES debido a que la memoria del último paquete SDES es liberada y el resto de la memoria es filtrada en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/april-2021-bulletin • CWE-401: Missing Release of Memory after Effective Lifetime •

CVSS: 9.4EPSS: 0%CPEs: 806EXPL: 0

Out-of-bounds read vulnerability while accessing DTMF payload due to lack of check of buffer length before copying in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Una vulnerabilidad de lectura fuera de límites mientras se accede a la carga útil DTMF debido a una falta de comprobación de la longitud del búfer antes de copiar en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/april-2021-bulletin • CWE-125: Out-of-bounds Read •

CVSS: 9.4EPSS: 0%CPEs: 638EXPL: 0

Out of bound memory read while unpacking data due to lack of offset length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Una lectura de la memoria sin límites mientras se desempaquetan los datos debido a una falta de comprobación de la longitud del desplazamiento en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/april-2021-bulletin • CWE-125: Out-of-bounds Read •