CVSS: 8.4EPSS: 0%CPEs: 706EXPL: 0CVE-2022-40532 – Integer overflow or wraparound in WLAN
https://notcve.org/view.php?id=CVE-2022-40532
Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target. • https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin • CWE-190: Integer Overflow or Wraparound •
CVSS: 7.8EPSS: 0%CPEs: 450EXPL: 0CVE-2022-33302 – Improper validation of array index in User Identity Module
https://notcve.org/view.php?id=CVE-2022-33302
Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length. • https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin • CWE-129: Improper Validation of Array Index •
CVSS: 6.8EPSS: 0%CPEs: 452EXPL: 0CVE-2022-33289 – Improper validation of array index in Modem
https://notcve.org/view.php?id=CVE-2022-33289
Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card. • https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin • CWE-129: Improper Validation of Array Index •
CVSS: 7.8EPSS: 0%CPEs: 72EXPL: 0CVE-2019-10530
https://notcve.org/view.php?id=CVE-2019-10530
Lack of check of data truncation on user supplied data in kernel leads to buffer overflow in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, SD 210/SD 212/SD 205, SD 425, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24 Una falta de comprobación del truncamiento de datos en los datos suministrados por parte del usuario en el kernel conlleva a un desbordamiento del búfer en los productos Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en las versiones MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, SD 210/SD 212/SD 205, SD 425, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24. • https://source.android.com/security/bulletin/pixel/2019-11-01 • CWE-190: Integer Overflow or Wraparound •
CVSS: 10.0EPSS: 0%CPEs: 92EXPL: 0CVE-2019-2332
https://notcve.org/view.php?id=CVE-2019-2332
Memory corruption while accessing the memory as payload size is not validated before access in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 600, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24 Una corrupción de la memoria al acceder a la memoria ya que el tamaño de la carga útil no se comprueba antes del acceso en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en las versiones MDM9150, MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 600, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24. • https://source.android.com/security/bulletin • CWE-787: Out-of-bounds Write •