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CVSS: 7.8EPSS: 0%CPEs: 324EXPL: 0

CVE-2022-22064

https://notcve.org/view.php?id=CVE-2022-22064

Possible buffer over read due to lack of size validation while unpacking frame in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Una posible lectura excesiva del búfer debido a una falta de comprobación del tamaño mientras es desempaquetada la trama en Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/may-2022-bulletin • CWE-125: Out-of-bounds Read •

CVSS: 7.7EPSS: 0%CPEs: 226EXPL: 0

CVE-2021-35116

https://notcve.org/view.php?id=CVE-2021-35116

APK can load a crafted model into the CDSP which can lead to a compromise of CDSP and other APK`s data executing there in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables El APK puede cargar un modelo diseñado en el CDSP, lo que puede conllevar a un compromiso de los datos del CDSP y de otros APK que sean ejecutados en Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/may-2022-bulletin • CWE-20: Improper Input Validation •

CVSS: 9.3EPSS: 0%CPEs: 112EXPL: 0

CVE-2021-35090

https://notcve.org/view.php?id=CVE-2021-35090

Possible hypervisor memory corruption due to TOC TOU race condition when updating address mappings in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile Posible corrupción de la memoria del hipervisor debido a una condición de carrera TOC TOU cuando son actualizadas las asignaciones de direcciones en Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile • https://www.qualcomm.com/company/product-security/bulletins/may-2022-bulletin • CWE-367: Time-of-check Time-of-use (TOCTOU) Race Condition •

CVSS: 7.8EPSS: 0%CPEs: 214EXPL: 0

CVE-2021-35078

https://notcve.org/view.php?id=CVE-2021-35078

Possible memory leak due to improper validation of certificate chain length while parsing server certificate chain in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables Una posible pérdida de memoria debido a una comprobación inapropiada de la longitud de la cadena de certificados mientras son analizadas la cadena de certificados del servidor en Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/may-2022-bulletin • CWE-401: Missing Release of Memory after Effective Lifetime •

CVSS: 7.8EPSS: 0%CPEs: 164EXPL: 0

CVE-2021-35072

https://notcve.org/view.php?id=CVE-2021-35072

Possible buffer overflow due to improper validation of array index while processing external DIAG command in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Un posible desbordamiento del búfer debido a una comprobación inapropiada del índice de la matriz mientras es procesado el comando DIAG externo en Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/may-2022-bulletin • CWE-129: Improper Validation of Array Index •