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CVSS: 7.8EPSS: 0%CPEs: 562EXPL: 0

Memory corruption in DSP Services during a remote call from HLOS to DSP. Corrupción de la memoria en los servicios DSP durante una llamada remota de HLOS a DSP. Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-416: Use After Free •

CVSS: 8.4EPSS: 0%CPEs: 234EXPL: 0

Memory corruption in Kernel while parsing metadata. Corrupción de la memoria en el Kernel al analizar metadatos. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-129: Improper Validation of Array Index •

CVSS: 7.5EPSS: 0%CPEs: 254EXPL: 0

Under certain scenarios the WLAN Firmware will reach an assertion due to state confusion while looking up peer ids. En ciertos escenarios, el firmware de WLAN alcanzará una afirmación debido a una confusión de estado al buscar ID de pares. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-617: Reachable Assertion •

CVSS: 6.5EPSS: 0%CPEs: 626EXPL: 0

Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE. Divulgación de información cuando se accede a las direcciones de símbolos de metadatos de la aplicación confiable mientras se carga un ELF en TEE. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-119: Improper Restriction of Operations within the Bounds of a Memory Buffer •

CVSS: 8.8EPSS: 0%CPEs: 562EXPL: 0

Memory corruption while loading an ELF segment in TEE Kernel. Corrupción de la memoria al cargar un segmento ELF en TEE Kernel. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-119: Improper Restriction of Operations within the Bounds of a Memory Buffer CWE-680: Integer Overflow to Buffer Overflow •