CVSS: 7.5EPSS: 0%CPEs: 526EXPL: 0CVE-2023-33098 – Buffer Over-read in WLAN Firmware
https://notcve.org/view.php?id=CVE-2023-33098
Transient DOS while parsing WPA IES, when it is passed with length more than expected size. DOS transitorio al analizar WPA IES, cuando se pasa con una longitud mayor que el tamaño esperado. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-125: Out-of-bounds Read CWE-126: Buffer Over-read •
CVSS: 8.4EPSS: 0%CPEs: 612EXPL: 0CVE-2023-33088 – NULL pointer dereference in WLAN Firmware
https://notcve.org/view.php?id=CVE-2023-33088
Memory corruption when processing cmd parameters while parsing vdev. Corrupción de la memoria al procesar parámetros cmd mientras se analiza vdev. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-476: NULL Pointer Dereference •
CVSS: 7.5EPSS: 0%CPEs: 732EXPL: 0CVE-2023-33080 – Buffer over-read in WLAN Firmware
https://notcve.org/view.php?id=CVE-2023-33080
Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. DOS transitorio mientras se analiza un IE (elemento de información) específico del fabricante del frame de gestión de respuesta de reasociación. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-125: Out-of-bounds Read CWE-126: Buffer Over-read •
CVSS: 7.8EPSS: 0%CPEs: 288EXPL: 0CVE-2023-33079 – Use of Out-of-range Pointer Offset in Audio
https://notcve.org/view.php?id=CVE-2023-33079
Memory corruption in Audio while running invalid audio recording from ADSP. Corrupción de la memoria en audio mientras se ejecuta una grabación de audio no válida desde ADSP. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-119: Improper Restriction of Operations within the Bounds of a Memory Buffer CWE-823: Use of Out-of-range Pointer Offset •
CVSS: 7.8EPSS: 0%CPEs: 562EXPL: 0CVE-2023-33063 – Qualcomm Multiple Chipsets Use-After-Free Vulnerability
https://notcve.org/view.php?id=CVE-2023-33063
Memory corruption in DSP Services during a remote call from HLOS to DSP. Corrupción de la memoria en los servicios DSP durante una llamada remota de HLOS a DSP. Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-416: Use After Free •