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CVSS: 7.8EPSS: 0%CPEs: 562EXPL: 0

Memory corruption in DSP Services during a remote call from HLOS to DSP. Corrupción de la memoria en los servicios DSP durante una llamada remota de HLOS a DSP. Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-416: Use After Free •

CVSS: 8.4EPSS: 0%CPEs: 424EXPL: 0

Memory corruption in HLOS while invoking IOCTL calls from user-space. Corrupción de la memoria en HLOS al invocar llamadas IOCTL desde el espacio de usuario. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-190: Integer Overflow or Wraparound CWE-680: Integer Overflow to Buffer Overflow •

CVSS: 7.8EPSS: 0%CPEs: 526EXPL: 0

Memory corruption while using the UIM diag command to get the operators name. Corrupción de la memoria al utilizar el comando diag de User Identity Module (UIM) para obtener el nombre del operador. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-190: Integer Overflow or Wraparound CWE-680: Integer Overflow to Buffer Overflow •

CVSS: 7.8EPSS: 0%CPEs: 554EXPL: 0

Memory corruption in Boot while running a ListVars test in UEFI Menu during boot. Corrupción de la memoria en el arranque mientras se ejecuta una prueba ListVars en el menú UEFI durante el arranque. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-120: Buffer Copy without Checking Size of Input ('Classic Buffer Overflow') •

CVSS: 7.5EPSS: 0%CPEs: 428EXPL: 2

Transient DOS in Bluetooth Host while rfc slot allocation. DOS transitorio en el host Bluetooth mientras se asigna la ranura RFC. • https://github.com/Trinadh465/CVE-2023-28588 https://github.com/uthrasri/CVE-2023-28588 https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-190: Integer Overflow or Wraparound •