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CVSS: 7.8EPSS: 0%CPEs: 56EXPL: 0

CVE-2019-14015

https://notcve.org/view.php?id=CVE-2019-14015

A stack-based buffer overflow exists in the initialization of the identification stage due to lack of check on the number of templates provided. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8096, APQ8096AU, MDM9205, MSM8996, MSM8996AU, Nicobar, QCS404, QCS405, QCS605, Rennell, SA6155P, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130, SXR2130 Se presenta un desbordamiento del búfer en la región stack de la memoria en la inicialización de la etapa de identificación debido a la falta de comprobación del número de plantillas proporcionadas. En los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking en las versiones APQ8096, APQ8096AU, MDM9205, MSM8996, MSM8996AU, Nicobar, QCS404, QCS405, QCS605, Rennell, SA6155P, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130, SXR2130. • https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin • CWE-787: Out-of-bounds Write •

CVSS: 10.0EPSS: 0%CPEs: 34EXPL: 0

CVE-2019-10612

https://notcve.org/view.php?id=CVE-2019-10612

UTCB object has a function pointer called by the reaper to deallocate its memory resources and this address can potentially be corrupted by stack overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, MDM9650, QCS605, SA6155P, SC8180X, SDA845, SDM670, SDM710, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 Un objeto UTCB presenta un puntero de función llamado mediante el segador para desasignar sus recursos de la memoria y esta dirección puede ser potencialmente corrompida por el desbordamiento de la pila en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking en las versiones MDM9205, MDM9650, QCS605, SA6155P, SC8180X, SDA845, SDM670, SDM710, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130. • https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin • CWE-787: Out-of-bounds Write •

CVSS: 10.0EPSS: 0%CPEs: 102EXPL: 0

CVE-2019-10593

https://notcve.org/view.php?id=CVE-2019-10593

Buffer overflow can occur when processing non standard SDP video Image attribute parameter in a VILTE\VOLTE call in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8076, APQ8096, APQ8096AU, APQ8098, MDM9150, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, Rennell, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130 Se puede presentar un desbordamiento del búfer cuando se procesa un parámetro de atributo de Imagen de vídeo SDP no estándar en una llamada VILTE\VOLTE en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en las versiones APQ8009, APQ8017, APQ8053, APQ8076, APQ8096, APQ8096AU, APQ8098, MDM9150, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, Rennell, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130. • https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin • CWE-120: Buffer Copy without Checking Size of Input ('Classic Buffer Overflow') •

CVSS: 10.0EPSS: 0%CPEs: 108EXPL: 0

CVE-2019-10594

https://notcve.org/view.php?id=CVE-2019-10594

Stack overflow can occur when SDP is received with multiple payload types in the FMTP attribute of a video M line in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8076, APQ8096, APQ8096AU, APQ8098, MDM9150, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, Rennell, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130 Se puede presentar un desbordamiento de la pila cuando es recibido un SDP con múltiples tipos de carga útil en el atributo FMTP de una línea M de vídeo en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en las versiones APQ8009, APQ8017, APQ8053, APQ8076, APQ8096, APQ8096AU, APQ8098, MDM9150, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, Rennell, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130. • https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin • CWE-129: Improper Validation of Array Index CWE-787: Out-of-bounds Write •

CVSS: 10.0EPSS: 0%CPEs: 106EXPL: 0

CVE-2019-10587

https://notcve.org/view.php?id=CVE-2019-10587

Possible Stack overflow can occur when processing a large SDP body or non standard SDP body without right delimiters in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, MDM9150, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, Rennell, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130 Se puede presentar un posible desbordamiento de la pila cuando se procesa un cuerpo de SDP grande o un cuerpo de SDP no estándar sin delimitadores correctos en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en las versiones APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, MDM9150, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, Rennell, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130. • https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin • CWE-787: Out-of-bounds Write •