CVE-2022-25666
https://notcve.org/view.php?id=CVE-2022-25666
Memory corruption due to use after free in service while trying to access maps by different threads in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Una corrupción de memoria debido al uso de memoria previamente liberada en el servicio mientras es intentado acceder a los mapas por diferentes hilos en Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking • https://www.qualcomm.com/company/product-security/bulletins/october-2022-bulletin • CWE-416: Use After Free •
CVE-2022-25664 – Qualcomm Adreno GPU Information Leak
https://notcve.org/view.php?id=CVE-2022-25664
Information disclosure due to exposure of information while GPU reads the data in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables Una revelación de información debido a una exposición de información mientras la GPU lee los datos en Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables • http://packetstormsecurity.com/files/172853/Qualcomm-Adreno-GPU-Information-Leak.html https://www.qualcomm.com/company/product-security/bulletins/october-2022-bulletin • CWE-459: Incomplete Cleanup •
CVE-2022-22078
https://notcve.org/view.php?id=CVE-2022-22078
Denial of service in BOOT when partition size for a particular partition is requested due to integer overflow when blocks are calculated in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables Una denegación de servicio en BOOT cuando es solicitado el tamaño de una partición particular debido a un desbordamiento de enteros cuando son calculados los bloques en Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/october-2022-bulletin • CWE-190: Integer Overflow or Wraparound •
CVE-2022-22058
https://notcve.org/view.php?id=CVE-2022-22058
Memory corruption due to use after free issue in kernel while processing ION handles in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Una corrupción de memoria debido a un problema de uso de memoria previamente liberada en el kernel mientras son procesados los manejadores ION en Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/july-2022-bulletin • CWE-416: Use After Free •
CVE-2022-22105
https://notcve.org/view.php?id=CVE-2022-22105
Memory corruption in bluetooth due to integer overflow while processing HFP-UNIT profile in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Mobile, Snapdragon Voice & Music Corrupción de memoria en bluetooth debido a un desbordamiento de enteros mientras es procesado el perfil HFP-UNIT en Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Mobile, Snapdragon Voice & Music • https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin • CWE-190: Integer Overflow or Wraparound •