CVE-2023-33092 – Buffer Copy Without Checking Size of Input in Bluetooth HOST
https://notcve.org/view.php?id=CVE-2023-33092
Memory corruption while processing pin reply in Bluetooth, when pin code received from APP layer is greater than expected size. Corrupción de la memoria al procesar la respuesta del PIN en Bluetooth, cuando el código PIN recibido desde la capa de la APLICACIÓN es mayor que el tamaño esperado. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-119: Improper Restriction of Operations within the Bounds of a Memory Buffer CWE-120: Buffer Copy without Checking Size of Input ('Classic Buffer Overflow') •
CVE-2023-33088 – NULL pointer dereference in WLAN Firmware
https://notcve.org/view.php?id=CVE-2023-33088
Memory corruption when processing cmd parameters while parsing vdev. Corrupción de la memoria al procesar parámetros cmd mientras se analiza vdev. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-476: NULL Pointer Dereference •
CVE-2023-33080 – Buffer over-read in WLAN Firmware
https://notcve.org/view.php?id=CVE-2023-33080
Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. DOS transitorio mientras se analiza un IE (elemento de información) específico del fabricante del frame de gestión de respuesta de reasociación. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-125: Out-of-bounds Read CWE-126: Buffer Over-read •
CVE-2023-33070 – Improper Authentication in Automotive OS
https://notcve.org/view.php?id=CVE-2023-33070
Transient DOS in Automotive OS due to improper authentication to the secure IO calls. DOS transitorio en sistemas operativos automotrices debido a una autenticación incorrecta en las llamadas IO seguras. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-287: Improper Authentication •
CVE-2023-33063 – Qualcomm Multiple Chipsets Use-After-Free Vulnerability
https://notcve.org/view.php?id=CVE-2023-33063
Memory corruption in DSP Services during a remote call from HLOS to DSP. Corrupción de la memoria en los servicios DSP durante una llamada remota de HLOS a DSP. Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-416: Use After Free •