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CVSS: 8.4EPSS: 0%CPEs: 612EXPL: 0

Memory corruption when processing cmd parameters while parsing vdev. Corrupción de la memoria al procesar parámetros cmd mientras se analiza vdev. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-476: NULL Pointer Dereference •

CVSS: 7.8EPSS: 0%CPEs: 236EXPL: 0

Memory corruption in Core while processing RX intent request. Corrupción de la memoria en Core mientras se procesa la solicitud de intención RX. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-120: Buffer Copy without Checking Size of Input ('Classic Buffer Overflow') •

CVSS: 7.5EPSS: 0%CPEs: 298EXPL: 0

Transient DOS while converting TWT (Target Wake Time) frame parameters in the OTA broadcast. DOS transitorio al convertir parámetros de fotograma TWT (Target Wake Time) en la transmisión OTA. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-125: Out-of-bounds Read CWE-126: Buffer Over-read •

CVSS: 7.5EPSS: 0%CPEs: 732EXPL: 0

Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. DOS transitorio mientras se analiza un IE (elemento de información) específico del fabricante del frame de gestión de respuesta de reasociación. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-125: Out-of-bounds Read CWE-126: Buffer Over-read •

CVSS: 7.8EPSS: 0%CPEs: 562EXPL: 0

Memory corruption in DSP Services during a remote call from HLOS to DSP. Corrupción de la memoria en los servicios DSP durante una llamada remota de HLOS a DSP. Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-416: Use After Free •