CVSS: 8.4EPSS: 0%CPEs: 612EXPL: 0CVE-2023-33088 – NULL pointer dereference in WLAN Firmware
https://notcve.org/view.php?id=CVE-2023-33088
Memory corruption when processing cmd parameters while parsing vdev. Corrupción de la memoria al procesar parámetros cmd mientras se analiza vdev. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-476: NULL Pointer Dereference •
CVSS: 7.8EPSS: 0%CPEs: 236EXPL: 0CVE-2023-33087 – Buffer Copy without Checking Size of Input (`Classic Buffer Overflow`) in Core
https://notcve.org/view.php?id=CVE-2023-33087
Memory corruption in Core while processing RX intent request. Corrupción de la memoria en Core mientras se procesa la solicitud de intención RX. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-120: Buffer Copy without Checking Size of Input ('Classic Buffer Overflow') •
CVSS: 7.5EPSS: 0%CPEs: 298EXPL: 0CVE-2023-33081 – Buffer over-read in WLAN Firmware
https://notcve.org/view.php?id=CVE-2023-33081
Transient DOS while converting TWT (Target Wake Time) frame parameters in the OTA broadcast. DOS transitorio al convertir parámetros de fotograma TWT (Target Wake Time) en la transmisión OTA. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-125: Out-of-bounds Read CWE-126: Buffer Over-read •
CVSS: 7.5EPSS: 0%CPEs: 732EXPL: 0CVE-2023-33080 – Buffer over-read in WLAN Firmware
https://notcve.org/view.php?id=CVE-2023-33080
Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. DOS transitorio mientras se analiza un IE (elemento de información) específico del fabricante del frame de gestión de respuesta de reasociación. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-125: Out-of-bounds Read CWE-126: Buffer Over-read •
CVSS: 7.8EPSS: 0%CPEs: 562EXPL: 0CVE-2023-33063 – Qualcomm Multiple Chipsets Use-After-Free Vulnerability
https://notcve.org/view.php?id=CVE-2023-33063
Memory corruption in DSP Services during a remote call from HLOS to DSP. Corrupción de la memoria en los servicios DSP durante una llamada remota de HLOS a DSP. Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP. • https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin • CWE-416: Use After Free •