CVSS: 9.1EPSS: 0%CPEs: 128EXPL: 0CVE-2021-30343
https://notcve.org/view.php?id=CVE-2021-30343
Improper integrity check can lead to race condition between tasks PDCP and RRC? after a valid RRC Command packet has been received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile Una comprobación de integridad inapropiada puede conllevar a una condición de carrera entre las tareas PDCP y RRC? después de que haya sido recibido un paquete de comando RRC válido en Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile • https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletin • CWE-367: Time-of-check Time-of-use (TOCTOU) Race Condition •
CVSS: 9.1EPSS: 0%CPEs: 190EXPL: 0CVE-2021-30342
https://notcve.org/view.php?id=CVE-2021-30342
Improper integrity check can lead to race condition between tasks PDCP and RRC? after a valid RRC Command packet has been received in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables Una comprobación de integridad inapropiada puede conllevar a una condición de carrera entre las tareas PDCP y RRC? después de que haya sido recibido un paquete de comando RRC válido en Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletin • CWE-367: Time-of-check Time-of-use (TOCTOU) Race Condition •
CVSS: 10.0EPSS: 0%CPEs: 240EXPL: 0CVE-2021-30341
https://notcve.org/view.php?id=CVE-2021-30341
Improper buffer size validation of DSM packet received can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables Una comprobación inapropiada del tamaño del búfer del paquete DSM recibido puede conllevar a una corrupción de la memoria en Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables • https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletin • CWE-787: Out-of-bounds Write •
CVSS: 7.8EPSS: 0%CPEs: 106EXPL: 0CVE-2021-30340
https://notcve.org/view.php?id=CVE-2021-30340
Reachable assertion due to improper validation of coreset in PDCCH configuration in SA mode in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile Una Aserción alcanzable debido a una comprobación inapropiada del conjunto de núcleos en la configuración PDCCH en el modo SA en Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile • https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletin • CWE-617: Reachable Assertion •
CVSS: 9.0EPSS: 0%CPEs: 110EXPL: 0CVE-2021-30339
https://notcve.org/view.php?id=CVE-2021-30339
Reading PRNG output may lead to improper key generation due to lack of buffer validation in Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Una lectura de la salida del PRNG puede conllevar a una generación incorrecta de claves debido a una falta de comprobación del búfer en Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking • https://www.qualcomm.com/company/product-security/bulletins/april-2022-bulletin •