CVE-2019-14037
https://notcve.org/view.php?id=CVE-2019-14037
Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130 Las operaciones de cierre y vinculación realizadas en un socket pueden conllevar a una condición de Uso de la Memoria Previamente Liberada en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en versiones APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130 • https://www.qualcomm.com/company/product-security/bulletins/july-2020-bulletin https://www.qualcomm.com/company/product-security/bulletins/july-2020-security-bulletin • CWE-416: Use After Free •
CVE-2019-14093
https://notcve.org/view.php?id=CVE-2019-14093
Array out of bound access can occur in display module due to lack of bound check on input parcel received in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9650, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, QCM2150, QCS405, QCS605, QM215, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM632, SDM636, SDM660, SDX20 Un acceso fuera de límites en la matriz puede ocurrir en el módulo de pantalla debido a una falta de comprobación de límite en el paquete de entrada recibido en los productos Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en versiones APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9650, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, QCM2150, QCS405, QCS605, QM215, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM632, SDM636, SDM660, SDX20 • https://www.qualcomm.com/company/product-security/bulletins/july-2020-bulletin https://www.qualcomm.com/company/product-security/bulletins/july-2020-security-bulletin • CWE-129: Improper Validation of Array Index •
CVE-2020-3663
https://notcve.org/view.php?id=CVE-2020-3663
Buffer over-write may occur during fetching track decoder specific information if cb size exceeds buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, Kamorta, MDM9206, MDM9207C, MDM9607, MSM8905, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, QCA6574AU, QCS405, QCS605, QM215, Rennell, Saipan, SDA660, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 Se puede presentar una sobreescritura del búfer durante la extracción de información específica del decodificador de pista si el tamaño de cb excede el tamaño del búfer en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en versiones APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, Kamorta, MDM9206, MDM9207C, MDM9607, MSM8905, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, QCA6574AU, QCS405, QCS605, QM215, Rennell, Saipan, SDA660, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 • https://www.qualcomm.com/company/product-security/bulletins/june-2020-bulletin https://www.qualcomm.com/company/product-security/bulletins/june-2020-security-bulletin • CWE-787: Out-of-bounds Write •
CVE-2020-3661
https://notcve.org/view.php?id=CVE-2020-3661
Buffer overflow will happen while parsing mp4 clip with corrupted sample atoms values which exceeds MAX_UINT32 range due to lack of validation checks in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, Kamorta, MDM9206, MDM9207C, MDM9607, MSM8905, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, QCA6574AU, QCS405, QCS605, QM215, Rennell, Saipan, SDA660, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 Un desbordamiento del búfer se presentará al analizar el clip mp4 con valores de átomos de muestra corruptos que exceden el rango de MAX_UINT32 debido a la falta de verificaciones de comprobación en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en versiones APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, Kamorta, MDM9206, MDM9207C, MDM9607, MSM8905, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, QCA6574AU, QCS405, QCS605, QM215, Rennell, Saipan, SDA660, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 • https://www.qualcomm.com/company/product-security/bulletins/june-2020-bulletin https://www.qualcomm.com/company/product-security/bulletins/june-2020-security-bulletin • CWE-120: Buffer Copy without Checking Size of Input ('Classic Buffer Overflow') •
CVE-2020-3662
https://notcve.org/view.php?id=CVE-2020-3662
Buffer overflow can occur while parsing eac3 header while playing the clip which is nonstandard in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MSM8909W, MSM8917, MSM8953, MSM8996, MSM8996AU, MSM8998, QCA6574AU, QCS405, QCS605, QM215, Rennell, Saipan, SDA660, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM845, SDX20, SM6150, SM7150, SM8150, SM8250, SXR2130 Un desbordamiento del búfer puede presentarse al analizar el encabezado eac3 mientras se reproduce el clip que no es estándar en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en versiones APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MSM8909W, MSM8917, MSM8953, MSM8996, MSM8996AU, MSM8998, QCA6574AU, QCS405, QCS605, QM215, Rennell, Saipan, SDA660, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM845, SDX20, SM6150, SM7150, SM8150, SM8250, SXR2130 • https://www.qualcomm.com/company/product-security/bulletins/june-2020-bulletin https://www.qualcomm.com/company/product-security/bulletins/june-2020-security-bulletin • CWE-120: Buffer Copy without Checking Size of Input ('Classic Buffer Overflow') •