Page 99 of 746 results (0.010 seconds)

CVSS: 5.5EPSS: 0%CPEs: 42EXPL: 0

CVE-2017-18275

https://notcve.org/view.php?id=CVE-2017-18275

A new account can be inserted into simContacts service using Android command line tool in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845. Se puede insertar una nueva cuenta en el servicio simContacts utilizando la herramienta de línea de comandos Android en Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear en MDM9206, MDM9607, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845. • https://www.qualcomm.com/company/product-security/bulletins •

CVSS: 7.8EPSS: 0%CPEs: 32EXPL: 0

CVE-2017-18274

https://notcve.org/view.php?id=CVE-2017-18274

While iterating through the models contained in a fixed-size array in the actData structure, which also stores an incorrect number of models that is greater than the size of the array, a buffer overflow occurs in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835 Al iterar a través de los modelos contenidos en un array de tamaño fijo en la estructura actData, que también almacena un número incorrecto de modelos mayor que el tamaño del array, se produce un desbordamiento de búfer en Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear en MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835 • https://www.qualcomm.com/company/product-security/bulletins • CWE-129: Improper Validation of Array Index •

CVSS: 7.8EPSS: 0%CPEs: 42EXPL: 0

CVE-2017-18157

https://notcve.org/view.php?id=CVE-2017-18157

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20. Una condición de uso después de liberar la memoria puede ocurrir en Thermal Engine en Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear en MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20. • https://www.qualcomm.com/company/product-security/bulletins • CWE-416: Use After Free •

CVSS: 7.8EPSS: 0%CPEs: 24EXPL: 0

CVE-2017-18156

https://notcve.org/view.php?id=CVE-2017-18156

While processing camera buffers in camera driver, a use after free condition can occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20. Durante el procesamiento de los búferes de la cámara en el controlador de la cámara, se puede producir una condición de referencia a memoria después de que haya sido liberada en Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear en MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20. • https://www.qualcomm.com/company/product-security/bulletins • CWE-416: Use After Free •

CVSS: 7.8EPSS: 0%CPEs: 56EXPL: 0

CVE-2017-18131

https://notcve.org/view.php?id=CVE-2017-18131

In QTEE, an incorrect fuse value can be blown in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 820, SD 820A, SD 835, SD 845, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016. En QTEE, se puede sobrecargar un valor de fusible incorrecto en Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear en las versiones MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 820, SD 820A, SD 835, SD 845, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016. • https://www.qualcomm.com/company/product-security/bulletins • CWE-665: Improper Initialization •